MMDT3904

DUAL NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR

Features

•

Epitaxial Planar Die Construction

•

Ideal for Low Power Amplification and Switching

•

Ultra-Small Surface Mount Package

•

Lead Free/RoHS Compliant (Note 2)

•

"Green" Device (Note 3 and 4)

Mechanical Data

•

Case: SOT-363

•

Case Material: Molded Plastic. UL Flammability

Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020C

•

Terminals: Solderable per MIL-STD-202, Method 208

•

Lead Free Plating (Matte Tin Finish annealed over

Alloy 42 leadframe).

•

Terminal Connections: See Diagram

•

Marking Information: See Page 4

•

Ordering Information: See Page 4

•

Weight: 0.006 grams (approximate)

A

M

J

L

D

B C

H

K

F

C

2

C

2

B

1

B

1

E

1

E

1

E

2

B

2

C

1

SOT-363

Dim

Min

Max

A

0.10

0.30

B

1.15

1.35

C

2.00

2.20

D

0.65 Nominal

F

0.30

0.40

H

1.80

2.20

J

—

0.10

K

0.90

1.00

L

0.25

0.40

M

0.10

0.25

α

0°

8°

All Dimens

mm

ions in

DS30088 Rev. 14 - 2

1 of 4

www.diodes.com

MMDT3904

© Diodes Incorporated

Characteristic

Symbol

Value

Unit

Collector-Base Voltage

60

V

Collector-Emitter Voltage

40

V

Emitter-Base Voltage

6.0

V

Collector Current - Continuous

200

mA

Power Dissipation

(Note 1)

200

mW

Thermal Resistance, Junction to Ambient

625

°C/W

Operating and Storage Temperature Range

-55 to +150

°C

Notes:

1. Device mounted on FR-4 PCB; pad layout as shown on Diodes Inc. suggested pad layout documents APO2001,

which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

2. No purposefully added lead.

3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.