MF1SPLUSX0Y1_SDS

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© NXP B.V. 2011. All rights reserved.

Product short data sheet

PUBLIC

Rev. 3.2 — 21 February 2011

187032

3 of 17

NXP Semiconductors

MF1SPLUSx0y1

Mainstream contactless smart card IC

5.

Ordering information

Table 2.

Ordering information

Type number

Package

Commercial

Name

Name

Description

Version

MF1SPLUS8001DUD/03 FFC

-

8 inch wafer (sawn; 120 µm thickness, on film frame

carrier; electronic fail die marking according to SECS-II

format) see Ref. 3, 4 kB EEPROM, 7-byte UID

-

MF1SPLUS8011DUD/03

FFC

-

8 inch wafer (sawn; 120 µm thickness, on film frame

carrier; electronic fail die marking according to SECS-II

format) see Ref. 3, 4 kB EEPROM, 4-byte UID

-

MF1SPLUS8031DUD/03 FFC

-

8 inch wafer (sawn; 120 µm thickness, on film frame

carrier; electronic fail die marking according to SECS-II

format), 4K EEPROM, 4-byte NUID

-

MF1SPLUS8001DA4/03

MOA4

PLLMC

plastic leadless module carrier package; 35 mm wide tape,

4 kB EEPROM, 7-byte UID

SOT500-2

MF1SPLUS8011DA4/03

MOA4

PLLMC

plastic leadless module carrier package; 35 mm wide tape,

4 kB EEPROM, 4-byte UID

SOT500-2

MF1SPLUS8031DA4/03

MOA4

PLLMC

plastic leadless module carrier package; 35 mm wide tape,

4K EEPROM, 4-byte NUID

SOT500-2

MF1SPLUS6001DUD/03 FFC

-

8 inch wafer (sawn; 120 µm thickness, on film frame

carrier; electronic fail die marking according to SECS-II

format) see Ref. 3, 2 kB EEPROM, 7-byte UID

-

MF1SPLUS6011DUD/03

FFC

-

8 inch wafer (sawn; 120 µm thickness, on film frame

carrier; electronic fail die marking according to SECS-II

format) see Ref. 3, 2 kB EEPROM, 4-byte UID

-

MF1SPLUS6031DUD/03 FFC

-

8 inch wafer (sawn; 120 µm thickness, on film frame

carrier; electronic fail die marking according to SECS-II

format), 2K EEPROM, 4byte NUID

-

MF1SPLUS6001DA4/03

MOA4

PLLMC

plastic leadless module carrier package; 35 mm wide tape,

2 kB EEPROM, 7-byte UID

SOT500-2

MF1SPLUS6011DA4/03

MOA4

PLLMC

plastic leadless module carrier package; 35 mm wide tape,

2 kB EEPROM, 4-byte UID

SOT500-2

MF1SPLUS6031DA4/03

MOA4

PLLMC

plastic leadless module carrier package; 35 mm wide tape,

2K EEPROM, 4-byte NUID

SOT500-2