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MIC384-0BMM Datasheet(PDF) 4 Page - Micrel Semiconductor

Part # MIC384-0BMM
Description  Three-Zone Thermal Supervisor
Download  22 Pages
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC384-0BMM Datasheet(HTML) 4 Page - Micrel Semiconductor

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MIC384
Micrel
MIC384
4
September 2005
Symbol
Parameter
Condition
Min
Typ
Max
Units
Serial Data I/O Pin (DATA)
VOL
Low Output Voltage
IOL = 3mA
0.4
V
Note 6
IOL = 6mA
0.8
V
VIL
Low Input Voltage
2.7V ≤ VDD ≤ 5.5V
0.3VDD
V
VIH
High Input Voltage
2.7V ≤ VDD ≤ 5.5V
0.7VDD
V
CIN
Input Capacitance
10
pF
ILEAK
Input current
±0.01
±1
µA
Serial Clock Input (CLK)
VIL
Low Input Voltage
2.7V ≤ VDD ≤ 5.5V
0.3VDD
V
VIH
High Input Voltage
2.7V ≤ VDD ≤ 5.5V
0.7VDD
V
CIN
Input Capacitance
10
pF
ILEAK
Input current
±0.01
±1
µA
Status Output (/INT)
VOL
Low Output Voltage,
IOL = 3mA
0.4
V
Note 6
IOL = 6mA
0.8
V
tINT
Interrupt Propagation Delay,
from TEMPx > T_SETx or TEMPx < T_HYSTx
tCONV+1
µs
Note 7, 8
to /INT < VOL, FQ = 00, RPULLUP = 10kΩ
tnINT
Interrupt Reset Propagation Delay,
from any register read to /INT > VOH,
1
µs
Note 7
RPULLUP = 10kΩ
T_SET0
Default T_SET0 Value
tPOR after VDD > VPOR
81
81
81
°C
T_HYST0
Default T_HYST0 Value
tPOR after VDD > VPOR
76
76
76
°C
T_SET1
Default T_SET1 Value
tPOR after VDD > VPOR
97
97
97
°C
T_HYST1
Default T_HYST1 Value
tPOR after VDD > VPOR
92
92
92
°C
T_SET2
Default T_SET2 Value
tPOR after VDD > VPOR
97
97
97
°C
T_HYST2
Default T_HYST2 Value
tPOR after VDD > VPOR
92
92
92
°C
Serial Interface Timing (Note 7)
t1
CLK (Clock) Period
2.5
µs
t2
Data In Setup Time to CLK High
100
ns
t3
Data Out Stable After CLK Low
0
ns
t4
DATA Low Setup Time to CLK Low
start condition
100
ns
t5
DATA High Hold Time
stop condition
100
ns
After CLK High
Note 1. Exceeding the absolute maximum rating may damage the device.
Note 2. The device is not guaranteed to function outside its operating rating.
Note 3. Devices are ESD sensitive. Handling precautions recommended.
Human body model: 1.5k in series with 100pF. Machine model: 200pF, no series resistance.
Note 4. Final test on outgoing product is performed at TA = TBD°C.
Note 5. TD is the temperature of the remote diode junction. Testing is performed using a single unit of one of the transistors listed in Table 6.
Note 6. Current into this pin will result in self-heating of the MIC384. Sink current should be minimized for best accuracy.
Note 7. Guaranteed by design over the operating temperature range. Not 100% production tested.
Note 8. tCONV = tCONV0 +(2 X tCONV1). tCONV0 is the conversion time for the local zone; tCONV1 is the conversion time for the remote zones.`
Note 9. Accuracy specification does not include quantization noise, which may be as great as ±12LSB (±0.5°C).


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