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MIC2074 Datasheet(PDF) 11 Page - Micrel Semiconductor |
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MIC2074 Datasheet(HTML) 11 Page - Micrel Semiconductor |
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11 / 16 page  Micrel, Inc. MIC2073/2074 January 2009 11 M9999-011209 Block Diagram MIC2073/2074 Block Diagram Functional Description Thermal Shutdown Thermal shutdown is employed to protect the device from damage should the die temperature exceed safe margins due mainly to short circuit faults. Each channel employs its own thermal sensor. Thermal shutdown shuts off the output MOSFET and asserts the FLG output if the die temperature reaches 140°C and the overheated channel is in current limit. The other channel is not affected. If however, the die temperature exceeds 160°C, then both channels will be shut off. Upon determining a thermal shutdown condition, the MIC2074 will latch the output off. In this case, a pull-up current source is activated. This allows the output latch to automatically reset when the load (such as a USB device) is removed. The output can also be reset by toggling EN. Refer to Figure 1 for timing details. Input and Output IN is the power supply connection to the logic circuitry and the drain of the output MOSFET. OUT is the source of the output MOSFET. In a typical circuit, current flows from IN to OUT toward the load when the switch is enabled. An important consideration in a choosing switch is whether it has “reverse voltage protection” that is, does not have a body diode. Reverse voltage protection is important when the switch is disabled and a voltage is presented to the OUT pin that is greater than the VIN voltage. The reverse voltage protection prevents current flow in the reverse path from OUT to IN. On other hand when the switch is enabled the switch is bidirectional. In this case when a voltage is presented to the OUT pin that is greater than the VIN voltage, current will flow from OUT to IN. The MIC2073 will automatically reset its output when the die temperature cools down to 120°C. The MIC2073 output and FLG signal will continue to cycle on and off until the device is disabled or the fault is removed. Figure 2 depicts typical timing. The output MOSFET and driver circuitry are also designed to allow the MOSFET source to be externally forced to a higher voltage than the drain (VOUT > VIN) when the switch is disabled. In this situation, the MIC2073/2074 prevents undesirable current flow from OUT to IN. Depending upon PCB layout package, ambient temperature, etc., it may take several hundred milliseconds from the incidence of the fault to the output MOSFET being shut off. This time will be shortest in the case of a dead short on the output. |
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Similar Description - MIC2074 |
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