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MIC5200-3.3BMM Datasheet(PDF) 8 Page - Micrel Semiconductor |
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MIC5200-3.3BMM Datasheet(HTML) 8 Page - Micrel Semiconductor |
8 / 10 page MIC5200 Micrel, Inc. April 2005 8 M9999-040805 Thermal Considerations Applications Information External Capacitors A1µFcapacitorisrecommendedbetweentheMIC5200output and ground to prevent oscillations due to instability. Larger values serve to improve the regulator’s transient response. Most types of tantalum or aluminum electrolytics will be ad- equate; film types will work, but are costly and therefore not recommended.Manyaluminumelectrolyticshaveelectrolytes that freeze at about –30°C, so solid tantalum capacitors are recommended for operation below –25°C. The important pa- rameters of the capacitor are an effective series resistance of about 5Ω or less and a resonant frequency above 500kHz. The value of this capacitor may be increased without limit. At lower values of output current, less output capacitance is required for output stability. The capacitor can be reduced to 0.47µF for current below 10mA or 0.33µF for currents below 1 mA. A 1µF capacitor should be placed from the MIC5200 input to ground if there is more than 10 inches of wire between the input and the AC filter capacitor or if a battery is used as the input. The MIC5200 will remain stable and in regulation with no load in addition to the internal voltage divider, unlike many other voltage regulators. This is especially important in CMOS RAM keep-alive applications. When used in dual supply systems where the regulator load is returned to a negative supply, the output voltage must be diode clamped to ground. ENABLE Input The MIC5200 features nearly zero OFF mode current. When the ENABLE input is held below 0.7V, all internal circuitry is powered off. Pulling this pin high (over 2.0V) re-enables the device and allows operation.The ENABLE pin requires a small amount of current, typically 15µA. While the logic threshold is TTL/CMOS compatible, ENABLE may be pulled as high as 30V, independent of the voltage on V IN. PC Board θ JA Dielectric FR4 160°C/W Ceramic 120°C/W Multi-layer boards having a ground plane, wide traces near the pads, and large supply bus lines provide better thermal conductivity. The “worst case” value of 160°C/W assumes no ground plane, minimum trace widths, and a FR4 material board. Part II. Nominal Power Dissipation and Die Temperature The MIC5200-xxBM at a 25°C ambient temperature will oper- ate reliably at up to 625mW power dissipation when mounted in the “worst case” manner described above. At an ambient temperature of 55°C, the device may safely dissipate 440mW. These power levels are equivalent to a die temperature of 125°C, the recommended maximum temperature for non- military grade silicon integrated circuits. For MIC5200-xxBS (SOT-223 package) heat sink character- istics, please refer to Micrel Application Hint 17, “Calculating P.C. Board Heat Sink Area for Surface Mount Packages”. Part I. Layout The MIC5200-xxBM (8-pin surface mount package) has the following thermal characteristics when mounted on a single layer copper-clad printed circuit board. 245 mil 150 mil 50 mil 50 mil 30 mil Minimum recommended board pad size, SO-8. |
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