Micrel, Inc.

SY89112U

July 2010

5

M9999-072809-D

hbwhelp@micrel.com or (408) 955-1690

Absolute Maximum Ratings

(1)

Continuous............................................................50mA

Surge ..................................................................100mA

Termination Current

Source or sink current on VT............................

±100mA

Input Current

Source or sink current on CLK, /CLK .................

±50mA

Source or sink current...........................................

±2mA

Lead Temperature (soldering, 20sec) ......................

+260°C

Storage Temperature (TS) ........................

−65°C to +150°C

Operating Rating(2)

+3.0V to +3.6V

QFN (

θ

Still-Air......................................................42

°C/W

QFN (

ψ

Junction-to-Board ....................................20

°C/W

DC Electrical Characteristics

(4)

Symbol

Parameter

Condition

Min.

Typ.

Max.

Units

Power Supply

2.375

3.0

2.625

3.6

V

V

Power Supply Current

95

130

mA

Input Resistance (IN-to-VT)

45

50

55

Ω

Differential Input Resistance (IN-to-/IN)

90

100

110

Ω

Input High Voltage (IN, /IN)

1.2

V

Input Low Voltage (IN, /IN)

0

V

Input Voltage Swing (IN, /IN)

See Figure 1a.

0.1

1.7

V

Differential Input Voltage Swing

|IN–/IN|

See Figure 1b.

0.2

V

IN-to-VT (IN, /IN)

1.28

V

Output Reference Voltage

V

Notes:

1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied

at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for extended

periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings

3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.

θ

are determined for a 4-layer board in still-air, unless otherwise stated.

4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.