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SY89112UMI Datasheet(PDF) 5 Page - Micrel Semiconductor |
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SY89112UMI Datasheet(HTML) 5 Page - Micrel Semiconductor |
5 / 14 page Micrel, Inc. SY89112U July 2010 5 M9999-072809-D hbwhelp@micrel.com or (408) 955-1690 Absolute Maximum Ratings (1) Supply Voltage (VCC) .................................... −0.5V to +4.0V Input Voltage (VIN) .......................................... −0.5V to VCC LVPECL Output Current (IOUT) Continuous............................................................50mA Surge ..................................................................100mA Termination Current Source or sink current on VT............................ ±100mA Input Current Source or sink current on CLK, /CLK ................. ±50mA VREF-AC Current Source or sink current........................................... ±2mA Lead Temperature (soldering, 20sec) ...................... +260°C Storage Temperature (TS) ........................ −65°C to +150°C Operating Rating(2) Supply Voltage (VCC)......................... +2.375V to +2.625V +3.0V to +3.6V Ambient Temperature (TA)....................... −40°C to +85°C Package Thermal Resistance(3) QFN ( θ JA) Still-Air......................................................42 °C/W QFN ( ψ JB) Junction-to-Board ....................................20 °C/W DC Electrical Characteristics (4) TA = –40°C to +85°C, unless otherwise stated. Symbol Parameter Condition Min. Typ. Max. Units VCC Power Supply 2.375 3.0 2.625 3.6 V V ICC Power Supply Current No load, max. VCC 95 130 mA RIN Input Resistance (IN-to-VT) 45 50 55 Ω RDIFF_IN Differential Input Resistance (IN-to-/IN) 90 100 110 Ω VIH Input High Voltage (IN, /IN) 1.2 VCC V VIL Input Low Voltage (IN, /IN) 0 VIH –0.1 V VIN Input Voltage Swing (IN, /IN) See Figure 1a. 0.1 1.7 V VDIFF_IN Differential Input Voltage Swing |IN–/IN| See Figure 1b. 0.2 V VT_IN IN-to-VT (IN, /IN) 1.28 V VREF-AC Output Reference Voltage VCC – 1.3 VCC – 1.2 VCC–1.1 V Notes: 1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings 3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. θ JA and ΨJB values are determined for a 4-layer board in still-air, unless otherwise stated. 4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. |
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