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SY89251VMGTR Datasheet(PDF) 3 Page - Micrel Semiconductor |
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SY89251VMGTR Datasheet(HTML) 3 Page - Micrel Semiconductor |
3 / 7 page Micrel, Inc. SY89251V June 2010 3 M9999-060410-A hbwhelp@micrel.com or (408) 955-1690 Absolute Maximum Ratings (1) Power Supply Voltage (VCC)......................... –0.5V to +6.0V ECL Input Voltage (VIN) ..............................0V to VCC +0.5V Voltage Applied to Output at HIGH State (VOUT) ........................................................ –0.5V to VCC Output Current (IOUT) Continuous ............................................................50mA Surge………………………………………………..100mA Lead Temperature (soldering, 20 sec.) ...................... 260°C Storage Temperature (TS) ........................–65°C to +150°C Operating Ratings (2) Power Supply Voltage |VCC–VEE|.............3.3V ±10% or 5V ±10% Ambient Temperature (TA) ..........................–40°C to +85°C Package Thermal Resistance,(3) DFN ( θ JA) Still-Air ........................................................... 93°C/W DFN ( ψ JB) ........................................................... 60°C/W DC Electrical Characteristics (4) T A = –40°C to +85°C, unless noted. Symbol Parameter Condition Min Typ Max Units VEE Power Supply |VCC–VEE| |VCC–VEE| 3.0 4.5 3.3 5.0 3.6 5.5 V V IEE Power Supply Current 46 mA IIL Input Low Current EN -150 µA VBB Output Reference Voltage VCC –1.38 VCC –1.32 VCC –1.26 V DC Electrical Characteristics (4) VCC = +3.3V ±10% or +5V ±10% and VEE = 0V; VCC = 0V and VEE = –3.3V ±10% or –5V ±10%; TA = –40°C to +85°C; unless noted. Symbol Parameter Condition Min Typ Max Units VOH Output HIGH Voltage Note 4 VCC–1.085 VCC–0.880 V VOL Output LOW Voltage Note 4 VCC–1.830 VCC–1.555 V VIH Input HIGH Voltage VCC–1.165 VCC–0.880 V VIL Input LOW Voltage VCC–1.810 VCC–1.475 V VPP Minimum Input Swing 150 mV IIH Input HIGH Current D 150 µA IIL Input LOW Current D 0.5 µA Notes: 1. Exceeding the absolute maximum rating may damage the device. 2. The device is not guaranteed to function outside its operating rating. 3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. 4. Output loaded with 50 Ω to V CC–2V. |
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