ZXMN6A11DN8

Issue 3 - September 2006

2

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© Zetex Semiconductors plc 2006

Absolute maximum ratings

NOTES:

(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air

conditions.

(b) For a device surface mounted on FR4 PCB measured at t

10 sec.

(c) Repetitive rating - 25mm x 25mm FR4 PCB, D=0.02, pulse width 300 s - pulse width limited by maximum junction

temperature.

(d) For a dual device with one active die.

(e) For a device with two active die running at equal power.

Parameter

Symbol

Limit

Unit

Drain-source voltage

60

V

Gate-source voltage

±20

V

Continuous drain current

3.2

A

2.6

2.5

Pulsed drain current(c)

13.7

A

Continuous source current (body diode)(b)

3.1

A

Pulsed source current (body diode)(c)

13.7

A

1.25

W

Linear derating factor

10

mW/°C

1.8

W

Linear derating factor

14

mW/°C

2.1

W

Linear derating factor

17

mW/°C

Operating and storage temperature range

-55 to +150

°C

Thermal resistance

Parameter

Symbol

Limit

Unit

Junction to ambient(a)(d)

100

°C/W

Junction to ambient(a)(e)

70

°C/W

Junction to ambient(b)(d)

60

°C/W