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ESD3301B2C Datasheet(PDF) 2 Page - Weitron Technology |
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ESD3301B2C Datasheet(HTML) 2 Page - Weitron Technology |
2 / 3 page http://www.weitron.com.tw WEITRON ESD0501B2C 2/3 1 5-Apr-09 Maximum Ratings (TA=25°C unless otherwise noted) l o b m y S r e t e m a r a P Limits Unit IEC61000 −4−2(ESD) Contact ±30 KV ESD voltage per human body model Per machine model 16 400 KV V Total power dissipation on FR-5 board (Note 1) PD 150 mW Thermal Resistance Junction −to− R t n e i b m A θJA 833 ℃/W Lead Solder Temperature − Maximum (10 Second Duration) TL 260 ℃ Junction and Storage temperature range Tj, Tstg -55 ~ +150 ℃ Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended. Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR −5 = 1.0 x 0.75 x 0.62 in. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM Working Peak Reverse Voltage IR Maximum Reverse Leakage Current @ VRWM VBR Breakdown Voltage @ IT IT Test Current IF Forward Current VF Forward Voltage @ IF Ppk Peak Power Dissipation C Max. Capacitance @VR=0 and f =1MHz ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10mA for all types) V RWM (V) I R (μA) @ V RWM V BR (V) @ I T(Note 2) I T Max I PP(A) (Note 3) V C (V) @Max IPP (A) (Note 3) P pk (W) (8 x 20μs) C (pF) Device* Device Marking Max Max Min mA - Max Typ Typ ESD3301B2C A 3.3 2.5 5.0 1.0 9.8 11.4 102 80 ESD0501B2C B 5.0 1.0 6.2 1.0 8.7 12.3 107 65 ESD1201B2C C 12 1.0 13.5 1.0 5.9 23.7 140 30 *Other voltages available upon request. 2. VBR is measured with a pulse test current IT at an ambient temperature of 25°C. 3. Surge current waveform per Figure 3. |
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