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PPC5643LF0VMM1 Datasheet(PDF) 1 Page - Freescale Semiconductor, Inc

Part # PPC5643LF0VMM1
Description  High-performance e200z4d dual core
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

PPC5643LF0VMM1 Datasheet(HTML) 1 Page - Freescale Semiconductor, Inc

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Freescale Semiconductor
Data Sheet: Advance Information
Document Number: MPC5643L
Rev. 6, 03/2011
© Freescale Semiconductor, Inc., 2009–2011. All rights reserved.
Preliminary—Subject to Change Without Notice
This document contains information on a product under development. Freescale reserves the
right to change or discontinue this product without notice.
MPC5643L
TBD
MAPBGA–225
15 mm x 15 mm
QFN12
##_mm_x_##mm
SOT-343R
##_mm_x_##mm
PKG-TBD
## mm x ## mm
257 MAPBGA
(14 x 14 mm)
144 LQFP
(20 x 20 mm)
1
Introduction
1.1
Document overview
This document describes the features of the family and
options available within the family members, and highlights
important electrical and physical characteristics of the
devices.
This document provides electrical specifications, pin
assignments, and package diagrams for the MPC5643L series
of microcontroller units (MCUs). For functional
characteristics, see the MPC5643L Microcontroller Reference
Manual. For use of the MPC5643Lin a fail-safe system
according to safety standard IEC 61508, see the Safety
Application Guide for MPC5643L.
The MPC5643L MCU series is available in two silicon
versions, or “cuts”. These are referred to as “cut1” and “cut2”
throughout this document. Functional differences between the
two cuts are clearly identified with the labels “cut1” and
“cut2”.
1.2
Description
The MPC5643L series microcontrollers are system-on-chip
devices that are built on Power Architecture technology and:
Contain enhancements that improve the
architecture’s fit in embedded applications
Include additional instruction support for digital
signal processing (DSP)
Integrate technologies such as an enhanced time
processor unit, enhanced queued analog-to-digital
converter, Controller Area Network, and an
enhanced modular input-output system
MPC5643L Microcontroller
Data Sheet
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3
Device comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.4
Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5
Feature summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.6
Feature details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2
Package pinouts and signal descriptions . . . . . . . . . . . . . . . . 22
2.1
Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.2
Supply pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
2.3
System pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
2.4
Pin muxing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
3
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
3.1
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
3.2
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . 72
3.3
Recommended operating conditions . . . . . . . . . . . . . . 73
3.4
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . 74
3.5
Electromagnetic Interference (EMI) characteristics
(cut1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
3.6
Electrostatic discharge (ESD) characteristics. . . . . . . . 77
3.7
Static latch-up (LU). . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
3.8
Voltage regulator electrical characteristics . . . . . . . . . . 78
3.9
DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . 81
3.10 Supply current characteristics (cut2) . . . . . . . . . . . . . . 82
3.11 Temperature sensor electrical characteristics . . . . . . . 83
3.12 Main oscillator electrical characteristics . . . . . . . . . . . . 83
3.13 FMPLL electrical characteristics. . . . . . . . . . . . . . . . . . 85
3.14 16 MHz RC oscillator electrical characteristics . . . . . . 87
3.15 ADC electrical characteristics. . . . . . . . . . . . . . . . . . . . 87
3.16 Flash memory electrical characteristics . . . . . . . . . . . . 92
3.17 SWG electrical characteristics . . . . . . . . . . . . . . . . . . . 93
3.18 AC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
3.19 Reset sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
3.20 AC timing characteristics . . . . . . . . . . . . . . . . . . . . . . 100
4
Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
4.1
Package mechanical data. . . . . . . . . . . . . . . . . . . . . . 112
5
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
6
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . 118


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