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CY7C1381D Datasheet(PDF) 8 Page - Cypress Semiconductor

Part # CY7C1381D
Description  18 Mbit (512 K 횞 36/1 M 횞 18) Flow Through SRAM
Download  34 Pages
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1381D Datasheet(HTML) 8 Page - Cypress Semiconductor

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CY7C1381D/CY7C1381F
CY7C1383D/CY7C1383F
Document Number: 38-05544 Rev. *I
Page 8 of 34
Pin Definitions
Name
I/O
Description
A0, A1, A
Input
Synchronous
Address inputs used to select one of the address locations. Sampled at the rising edge
of the CLK if ADSP or ADSC is active LOW, and CE1, CE2, and CE3 [4] are sampled active.
A[1:0] feed the 2-bit counter.
BWA, BWB
BWC, BWD
Input
Synchronous
Byte write select inputs, active LOW. Qualified with BWE to conduct byte writes to the SRAM.
Sampled on the rising edge of CLK.
GW
Input
Synchronous
Global write enable input, active LOW. When asserted LOW on the rising edge of CLK, a global
write is conducted (all bytes are written, regardless of the values on BW[A:D] and BWE).
CLK
Input
Clock
Clock input. Used to capture all synchronous inputs to the device. Also used to increment the
burst counter when ADV is asserted LOW, during a burst operation.
CE1
Input
Synchronous
Chip enable 1 input, active LOW. Sampled on the rising edge of CLK. Used in conjunction
with CE2 and CE3 [4] to select or deselect the device. ADSP is ignored if CE1 is HIGH. CE1 is
sampled only when a new external address is loaded.
CE2
Input
Synchronous
Chip enable 2 input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction
with CE1 and CE3 [4] to select or deselect the device. CE2 is sampled only when a new external
address is loaded.
CE3 [4]
Input
Synchronous
Chip enable 3 input, active LOW. Sampled on the rising edge of CLK. Used in conjunction
with CE1 and CE2 to select or deselect the device. CE3 is sampled only when a new external
address is loaded.
OE
Input
Asynchronous
Output enable, asynchronous input, active LOW. Controls the direction of the I/O pins.
When LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are tristated,
and act as input data pins. OE is masked during the first clock of a read cycle when emerging
from a deselected state.
ADV
Input
Synchronous
Advance input signal. Sampled on the rising edge of CLK. When asserted, it automatically
increments the address in a burst cycle.
ADSP
Input
Synchronous
Address strobe from processor, sampled on the rising edge of CLK, active LOW. When
asserted LOW, addresses presented to the device are captured in the address registers. A[1:0]
are also loaded into the burst counter. When ADSP and ADSC are both asserted, only ADSP
is recognized. ASDP is ignored when CE1 is deasserted HIGH.
ADSC
Input
Synchronous
Address strobe from controller, sampled on the rising edge of CLK, active LOW. When
asserted LOW, addresses presented to the device are captured in the address registers. A[1:0]
are also loaded into the burst counter. When ADSP and ADSC are both asserted, only ADSP
is recognized.
BWE
Input
Synchronous
Byte write enable input, active LOW. Sampled on the rising edge of CLK. This signal must
be asserted LOW to conduct a byte write.
ZZ
Input
Asynchronous
ZZ sleep input. This active HIGH input places the device in a non time critical sleep condition
with data integrity preserved. For normal operation, this pin has to be LOW or left floating. ZZ
pin has an internal pull down.
Note
4. CE3, CE2 are for TQFP and 165 FBGA packages only. 119 BGA is offered only in 1 chip enable.
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