Document #: 38-05442 Rev. *H

Page 5 of 14

Capacitance

Parameter[10]

Description

Test Conditions

Max

Unit

Input capacitance

10

pF

Output capacitance

10

pF

Thermal Resistance

Parameter [10]

Description

Test Conditions

SOIC

Package

TSOP II

Package

Unit

Θ

JA

Thermal resistance

(junction to ambient)

Still air, soldered on a 3 × 4.5 inch,

two-layer printed circuit board

75

77

°C/W

Θ

JC

Thermal resistance

(junction to case)

10

13

°C/W

Figure 2. AC Test Loads and Waveforms

Parameter [10]

5.0 V

Unit

R1

1800

Ω

R2

990

Ω

639

Ω

1.77

V

Data Retention Characteristics

Over the operating range

Parameter

Description

Conditions

Min

Typ[11]

Max

Unit

2

–

–

V

[12]

Data retention current

Industrial/

Automotive-A

–1

7

µA

Chip deselect to data retention time

0

–

–

ns

[13]

Operation recovery time

TSOP II

45

–

–

ns

SOIC

55

–

–

ns

Notes

10. Tested initially and after any design or process changes that may affect these parameters.

3.0 V

OUTPUT

R2

30 pF

INCLUDING

JIG AND

SCOPE

GND

90%

10%

90%

10%

Rise Time = 1 V/ns

Fall Time = 1 V/ns

OUTPUT

V

Equivalent to:

THEVENIN

EQUIVALENT

ALL INPUT PULSES

R1

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