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CY62167E Datasheet(PDF) 3 Page - Cypress Semiconductor |
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CY62167E Datasheet(HTML) 3 Page - Cypress Semiconductor |
3 / 15 page CY62167E MoBL® Document Number: 001-15607 Rev. *B Page 3 of 15 Pin Configuration[2, 3] 48-Pin TSOP I Top View Product Portfolio Product VCC Range (V) Speed (ns) Power Dissipation Operating ICC (mA) Standby ISB2 (µA) f = 1 MHz f = fmax Min Typ[4] Max Typ[4] Max Typ[4] Max Typ[4] Max CY62167ELL 4.5 5.0 5.5 45 2.2 4.0 25 30 1.5 12 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A15 A14 A13 A12 A11 A10 A9 A8 A19 NC WE CE2 NC BHE BLE A18 A17 A7 A6 A5 A4 A3 A2 A1 A16 BYTE Vss I/O15/A20 I/O7 I/O14 I/O6 I/O13 I/O5 I/O12 I/O4 Vcc I/O11 I/O3 I/O10 I/O2 I/O9 I/O1 I/O8 I/O0 OE Vss CE1 A0 Notes 2. NC pins are not connected on the die. 3. The BYTE pin in the 48-TSOPI package must be tied to VCC to use the device as a 1 M × 16 SRAM. The 48-TSOPI package can also be used as a 2 M × 8 SRAM by tying the BYTE signal to VSS. In the 2 M × 8 configuration, pin 45 is A20, while BHE, BLE and I/O8 to I/O14 pins are not used. 4. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ), TA = 25 °C. [+] Feedback |
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