Document #: 38-05446 Rev. *I

Page 3 of 16

Pin Configuration

Figure 1. 48-Ball VFBGA (6 x 8 x 1mm) Top View [1, 2]

Figure 2. 48-Pin TSOP I Top View [2, 3]

Product Portfolio

Product

Range

Speed

(ns)

Power Dissipation

(

μA)

f = 1 MHz

Min

Typ[4]

Max

Typ[4]

Max

Typ[4]

Max

Typ[4]

Max

CY62167EV30LL

Industrial/Auto-A

2.2

3.0

3.6

45

2.2

4.0

25

30

1.5

12

WE

OE

Vss

BHE

BLE

A

12

NC

3

2

6

5

4

1

D

E

B

A

C

F

G

H

NC

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

A15

A14

A13

A12

A11

A10

A9

A8

A19

NC

WE

NC

BHE

BLE

A18

A17

A7

A6

A5

A4

A3

A2

A1

A16

BYTE

Vss

I/O15/A20

I/O7

I/O14

I/O6

I/O13

I/O5

I/O12

I/O4

Vcc

I/O11

I/O3

I/O10

I/O2

I/O9

I/O1

I/O8

I/O0

OE

Vss

A0

Notes

1. Ball H6 for the VFBGA package can be used to upgrade to a 32M density.

2. NC pins are not connected on the die.

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