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MCP14E7T Datasheet(PDF) 4 Page - Microchip Technology

Part # MCP14E7T
Description  2.0A Dual High-Speed Power MOSFET Driver With Enable
Download  30 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP14E7T Datasheet(HTML) 4 Page - Microchip Technology

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MCP14E6/7/8
DS25006A-page 4
© 2011 Microchip Technology Inc.
Power Supply
Supply Voltage
VDD
4.5
18.0
V
Supply Current
IDD
1000
1800
µA
VIN_A =3V, VIN_B =3V,
ENB_A = ENB_B = High
IDD
600
900
µA
VIN_A =0V, VIN_B =0V,
ENB_A = ENB_B = High
IDD
800
1600
µA
VIN_A =3V, VIN_B =0V,
ENB_A = ENB_B = High
IDD
800
1600
µA
VIN_A =0V, VIN_B =3V,
ENB_A = ENB_B = High
IDD
600
1000
µA
VIN_A =3V, VIN_B =3V,
ENB_A = ENB_B = Low
IDD
300
450
µA
VIN_A =0V, VIN_B =0V,
ENB_A = ENB_B = Low
IDD
500
800
µA
VIN_A =3V, VIN_B =0V,
ENB_A = ENB_B = Low
IDD
500
800
µA
VIN_A =0V, VIN_B =3V,
ENB_A = ENB_B = Low
DC CHARACTERISTICS (OVER OPERATING TEMP. RANGE)(2)
Electrical Specifications:
Unless otherwise indicated, operating temperature range with 4.5V
≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input
Logic ‘1’, High Input Voltage
VIH
2.4
V
Logic ‘0’, Low Input Voltage
VIL
——
0.8
V
Input Current
IIN
-10
+10
µA
0V
≤ VIN ≤ VDD
Output
High Output Voltage
VOH
VDD – 0.025
V
DC Test
Low Output Voltage
VOL
0.025
V
DC Test
Output Resistance, High
ROH
—8
11
Ω
IOUT = 10 mA, VDD = 18V
Output Resistance, Low
ROL
—8
11
Ω
IOUT = 10 mA, VDD = 18V
Switching Time(1)
Rise Time
tR
—23
35
ns
Figure 4-1, Figure 4-2,
CL = 1000 pF
Fall Time
tF
—23
40
ns
Figure 4-1, Figure 4-2,
CL = 1000 pF
Propagation Delay Time
tD1
—50
65
ns
Figure 4-1, Figure 4-2
Propagation Delay Time
tD2
—50
65
ns
Figure 4-1, Figure 4-2
Note 1:
Switching times are ensured by design.
2:
Tested during characterization, not production tested.
DC CHARACTERISTICS(2) (CONTINUED)
Electrical Specifications:
Unless otherwise indicated, TA = +25°C, with 4.5V ≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Note 1:
Switching times are ensured by design.
2:
Tested during characterization, not production tested.
3:
Package power dissipation is dependent on the copper pad area of the PCB.


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