2001 Nov 27

4

Philips Semiconductors

Product specification

550 MHz, 22 dB gain push-pull amplifier

BGY587

PACKAGE OUTLINE

UNIT

A2

max.

c

ee1

q

Q

max.

q1

q2

U1

max.

U2

W

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

20.8

9.1

0.51

0.38

0.25 27.2 2.54 13.75 2.54 5.08 12.7

8.8

4.15

3.85

2.4

38.1 25.4 10.2

4.2 44.75

8

0.25

0.1

3.8

bF

p

6-32

UNC

y

w

S

DIMENSIONS (mm are the original dimensions)

SOT115J

0

5

10 mm

scale

A

max.

D

max.

L

min.

E

max.

Z

max.

Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;

2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads

SOT115J

D

U1

q

q2

q1

b

F

S

A

Z

p

E

A2

L

c

d

Q

U2

M

w

78

9

23

W

e

e1

5

p

1

d

max.

B

99-02-06