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K4B1G0446D Datasheet(PDF) 3 Page - Samsung semiconductor

Part # K4B1G0446D
Description  1Gb D-die DDR3 SDRAM Specification
Download  60 Pages
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

K4B1G0446D Datasheet(HTML) 3 Page - Samsung semiconductor

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Rev. 1.1 August 2008
1Gb DDR3 SDRAM
K4B1G04(08/16)46D
1.0 Ordering Information ................................................................................................................... 5
2.0 Key Features ................................................................................................................................ 5
3.0 Package pinout/Mechanical Dimension & Addressing ............................................................ 6
3.1 x4 Package Pinout (Top view) : 82ball FBGA Package(78balls + 4 balls of support balls)
..................... 6
3.2 x8 Package Pinout (Top view) : 82ball FBGA Package(78balls + 4 balls of support balls)
..................... 7
3.3 x16 Package Pinout (Top view) : 100ball FBGA Package(96balls + 4 balls of support balls)
................. 8
3.4 FBGA Package Dimension (x4/x8)
................................................................................................. 9
3.5 FBGA Package Dimension (x16)
.................................................................................................. 10
4.0 Input/Output Functional Description ....................................................................................... 11
5.0 DDR3 SDRAM Addressing ........................................................................................................ 12
6.0 Absolute Maximum Ratings ...................................................................................................... 13
6.1 Absolute Maximum DC Ratings
................................................................................................... 13
6.2 DRAM Component Operating Temperature Range
......................................................................... 13
7.0 AC & DC Operating Conditions ................................................................................................ 13
7.1 Recommended DC operating Conditions (SSTL_1.5)
...................................................................... 13
8.0 AC & DC Input Measurement Levels ........................................................................................ 14
8.1 AC and DC Logic input levels for single-ended signals
.................................................................. 14
8.2 VREF Tolerances ........................................................................................................................ 15
8.3 AC and DC Logic Input Levels for Ditterential Signals
.................................................................... 16
8.3.1 Differential signal definition
................................................................................................ 16
8.3.2 Differential swing requirement for clock (CK - CK) and strobe (DQS - DQS)
.............................. 16
8.3.3 Single-ended requirements for differential signals
................................................................. 17
8.4 Differential Input Cross Point Voltage
.......................................................................................... 18
8.5 Slew Rate Definition for Single Ended Input Signals
...................................................................... 18
8.6 Slew rate definition for Differential Input Signals
........................................................................... 18
9.0 AC and DC Output Measurement Levels.................................................................................. 19
9.1 Single Ended AC and DC Output Levels
....................................................................................... 19
9.2 Differential AC and DC Output Levels
.......................................................................................... 19
9.3.Single Ended Output Slew Rate
................................................................................................... 19
9.4 Differential Output Slew Rate
...................................................................................................... 20
9.5 Reference Load for AC Timing and Output Slew Rate
..................................................................... 20
9.6 Overshoot/Undershoot Specification
........................................................................................... 21
9.6.1 Address and Control Overshoot and Undershoot specifications
............................................. 21
9.6.2 Clock, Data, Strobe and Mask Overshoot and Undershoot specifications
................................. 21
9.7 34 ohm Output Driver DC Electrical Characteristics
....................................................................... 22
9.7.1 Output Drive Temperature and Voltage sensitivity
................................................................. 23
9.8 On-Die Termination (ODT) Levels and I-V Characteristics
............................................................... 23
9.8.1 ODT DC electrical characteristics
........................................................................................ 24
9.8.2 ODT Temperature and Voltage sensitivity
............................................................................. 25
9.9 ODT Timing Definitions
.............................................................................................................. 26
9.9.1 Test Load for ODT Timings
................................................................................................. 26
9.9.2 ODT Timing Definition
........................................................................................................ 26
Table Contents


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