K4B1G0846D-HCF8 datasheet(6/60 Pages) SAMSUNG

Part #	K4B1G0846D-HCF8

Description	1Gb D-die DDR3 SDRAM Specification

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Manufacturer	SAMSUNG [Samsung semiconductor]

Direct Link	http://www.samsung.com/Products/Semiconductor

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Page 6 of 60

Rev. 1.1 August 2008

1Gb DDR3 SDRAM

K4B1G04(08/16)46D

3.1 x4 Package Pinout (Top view) : 82ball FBGA Package(78balls + 4 balls of support balls)

Note : Green NC balls (A1, A11, N1 and N11) indicate mechanical support balls with no internal connection.

1

2

3

4

5

6

7

8

9

10

11

A

NC

VSS

VDD

NC

VSS

VDD

NC

A

B

VSS

VSSQ

DQ0

DM

VSSQ

VDDQ

B

C

VDDQ

DQ2

DQS

DQ1

DQ3

VSSQ

C

D

VSSQ

NC

DQS

VDD

VSS

VSSQ

D

E

VREFDQ

VDDQ

NC

VDDQ

E

F

NC

VSS

RAS

CK

VSS

NC

F

G

ODT

VDD

CAS

CK

VDD

CKE

G

H

NC

CS

WE

A10/AP

ZQ

NC

H

J

VSS

BA0

BA2

NC

VREFCA

VSS

J

K

VDD

A3

A0

A12/BC

BA1

VDD

K

L

VSS

A5

A2

A1

A4

VSS

L

M

VDD

A7

A9

A11

A6

VDD

M

N

NC

VSS

RESET

A13

NC

A8

VSS

NC

N

Populated ball

Ball not populated

Ball Locations (x4)

Top view

(See the balls through the package)

1234

89

567

A

B

C

D

E

F

G

H

J

K

L

N

M

10 11

3.0 Package pinout/Mechanical Dimension & Addressing

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K4B1G0846D-HCF8 Datasheet(PDF) 6 Page - Samsung semiconductor

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