Micrel, Inc.

SY88289HL

August 2007

3

M9999-082007-A

hbwhelp@micrel.com or (408) 955-1690

Absolute Maximum Ratings

(1)

Continuous…………….. ………………………±25mA

Lead Temperature (soldering, 20sec.) .................. 260°C

Operating Ratings

(2)

Junction Thermal Resistance

(3)

QFN (

θ

Still-air ..................................................... 61°C/W

QFN (

Ψ

Junction-to-board .....................................38

DC Electrical Characteristics

Ω to V

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply Current

No output load

42

62

mA

V

CML Output HIGH Voltage

V

CML Output LOW Voltage

V

Differential Output Offset

±80

mV

Reference Voltage

V

Input Common Mode Range

GND+2.0

V

TTL DC Electrical Characteristics

Ω to V

Symbol

Parameter

Condition

Min

Typ

Max

Units

/EN Input HIGH Voltage

2.0

/EN Input LOW Voltage

0.8

V

/EN Input HIGH Current

20

100

µA

µA

/EN Input LOW Current

-300

µA

LOS Output High Level

2.4

V

2.0

V

LOS Output LOW Level

Sinking 2mA

0.5

V

Notes:

1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not

implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions

for extended periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential (GND) on the PCB.

Ψ

JB

uses 4-layer (

θ