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GRM188R71C105KA120 Datasheet(PDF) 10 Page - Fairchild Semiconductor |
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GRM188R71C105KA120 Datasheet(HTML) 10 Page - Fairchild Semiconductor |
10 / 11 page © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN2560 • Rev. 1.0.1 10 Physical Dimensions A1 E 0.625 MAX SEATING PLANE 0.06 C 5 X Ø0.315 +/- .025 TOP VIEW BOTTOM VIEW (Ø0.35) SOLDER MASK OPENING (Ø0.25) Cu PAD RECOMMENDED LAND PATTERN (NSMD) BALL A1 INDEX AREA 0.03 C 0.05 C D 2X (Y)+/-.018 (X)+/-.018 B A D 0.250±0.025 C 1 2 A B C 0.03 C 2X E 0.005 CA B 0.50 0.433 0.50 (0.50) (0.433) (0.866) 3 0.332±0.018 SIDE VIEWS B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER A. NO JEDEC REGISTRATION APPLIES ASME Y14.5M, 1994 D DATUM C, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. E PACKAGE TYPICAL HEIGHT IS 582 MICRONS +/- 43 MICRONS (539-625 MICRONS) FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. G. BALL COMPOSITION: Sn95.5Ag3.9Cu0.6 SAC405 ALLOY H. DRAWING FILENAME: MKT-UC005AArev5 F F F F F Figure 26. Wafer-Level Chip-Scale Packaging (WLCSP) Product Specific Dimensions Product D E X Y FAN2560UC13X 1.330 +/- 0.030 0.960 +/- 0.030 0.230 0.232 FAN2560UC15X 1.330 +/- 0.030 0.960 +/- 0.030 0.230 0.232 Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. |
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