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Technical Data Sheet

0805 Package Chip LED

Preliminary

17-21-R7C-A0N1P2B0C-3T-AM

Everlight Electronics Co., Ltd.

http://www.everlight.com

Rev. 1

Page: 11 of

12

Device No:DSE-0001194

Prepared date: 9-Apr -2009

Created by: Wuhongmei

Precautions for Use

1. Soldering Condition

1.1 (A) Maximum Body Case Temperature Profile for evaluation of Reflow Profile

Note:

Preheat

150 °C

200°C

60-120 seconds

3 °C/second max.

Other

217 °C

60-150 sec

260°C

30 s

Ramp- Down Rate from Peak Temperature

6°C /second max.

Time 25°C to peak temperature

8 minutes max.

Reflow times

3 times

All parameters are maximum body case temperature values and cannot be considered as a

soldering profile. The body case temperature was measured by soldering a thermal couple to the

soldering point of LEDs.

Reference: IPC/JEDEC J-STD-020D