A7001AG_SDS

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© NXP B.V. 2011. All rights reserved.

Preliminary short data sheet

COMPANY PUBLIC

Rev. 1.1 — 18 March 2011

202011

10 of 16

NXP Semiconductors

A7001AG

Secure authentication microcontroller

8.

Memory

8.1 Available memory space

8.2 Garbage collection

Garbage collection is fully implemented (see Ref. 1): Deleted objects, applets, and

packages are fully reclaimed (incl. compactification) and the space can be used for other

purposes after deletion.

9.

Limiting values

[1]

MIL Standard 883-D method 3015; human body model; C = 100 pF, R = 1.5 k

Ω; T

[2]

Depending on appropriate thermal resistance of the package.

[3]

Depending on delivery type, refer to NXP Semiconductors General Specification for 8” Wafers and to NXP

Semiconductors Contact & Dual Interface Chip Card Module Specification.

10. Application information

Figure 4 shows a typical application diagram. It shows how the pins of the A7001AG shall

an individual reset control is not supported. The hardware reset will be executed at

power-up time (power-on reset).

Table 5.

A7001AG Memory Map

Product

type

Transient Heap

(RAM)

Persistent Heap

(EEPROM)

Free ROM for

Applets

APDU Buffer

A7001AG

3550 bytes

79900 bytes

133648 bytes

1462 bytes

Table 6.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to

VSS (ground = 0 V).

Symbol Parameter

Conditions

Min

Max

Unit

supply voltage

−0.5

+6.0

V

input voltage

any signal pad

−0.5

V

input current

pad IO1, IO2 or

IO3

-

±15.0

mA

output current

pad IO1, IO2 or

IO3

-

±15.0

mA

latch-up current

-

±100

mA

electrostatic discharge voltage

pads VDD, VSS,

CLK, RST_N, IO1,

IO2, IO3

[1] -

±4.0

kV

pads LA, LB

[1] -

±2.0

kV

total power dissipation

[2] -1

W

storage temperature

[3] --

°C