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BTA208S-600B Datasheet(PDF) 5 Page - NXP Semiconductors |
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BTA208S-600B Datasheet(HTML) 5 Page - NXP Semiconductors |
5 / 13 page BTA208S-600B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 13 April 2011 5 of 13 NXP Semiconductors BTA208S-600B 3Q Hi-Com Triac 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base full cycle; see Figure 6 --2 K/W half cycle; see Figure 6 --2.4 K/W Rth(j-a) thermal resistance from junction to ambient in free air; printed circuit board (FR4) mounted -75 - K/W Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width 003aaf584 tp (s) 10−5 110 10−1 10−2 10−4 10−3 1 10−1 10 Zth(j-mb) (K/W) 10−2 unidirectional bidirectional tp P t |
Similar Part No. - BTA208S-600B_11 |
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Similar Description - BTA208S-600B_11 |
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