P5CD016_021_041_51_Cx081_FAM_SDS

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© NXP B.V. 2011. All rights reserved.

Product short data sheet

PUBLIC

Rev. 3.2 — 14 March 2011

150332

10 of 20

NXP Semiconductors

P5CD016/021/041/051 and P5Cx081

Secure dual interface and contact PKI smart card controller

5.

Ordering information

Table 3.

Ordering information

Type number

Package

Name

Description

Version

P5CC081UA

FFC

8 inch wafer (sawn; 150

μm thickness; on film frame carrier;

electronic fail die marking according to SECSII format)

not applicable

P5CD016UA

P5CD021UA

P5CD041UA

P5CD051UA

P5CD081UA

P5CN081UA

P5CD016UE

FFC

8 inch wafer (sawn; 75

μm thickness; on film frame carrier;

electronic fail die marking according to SECSII format)

not applicable

P5CD021UE

P5CD041UE

P5CD051UE

P5CD081UE

P5CD016HN

HVQFN32

plastic thermal enhanced very thin quad flat package; no leads;

32 terminals; body 5

× 5 × 0.85 mm

SOT617-1

P5CD021HN

P5CC081HN

P5CN081HN

P5CD016A4

MOB4

contactless chip card module (super 35 mm tape format, module

thickness 320

μm)

SOT500-2

P5CD041A4

P5CD051A4

P5CD081A4

P5CD016A6

MOB6

contactless chip card module (super 35 mm tape format, module

thickness 250

μm)

SOT500-3

P5CD041A6

P5CD051A6

P5CD081A6

P5CC081XS

PCM1.1

contact chip card module (super 35 mm tape format, 8-contact)

SOT658-1

P5CC081XD

Pd-PCM1.1

palladium plated contact chip card module (super 35 mm tape

format, 8-contact)

SOT658-1

P5CD016X1

PDM1.1

dual interface chip card module (plug-in type; super 35 mm tape

format, 8-contact)

SOT658-3

P5CD021X1

P5CD041X1

P5CD051X1

P5CD081X1

P5CD016X0

PDM1.1

dual interface chip card module (super 35 mm tape format,

8-contact)

SOT658-3

P5CD021X0

P5CD041X0

P5CD051X0

P5CD081X0