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R5F52108ADFF Datasheet(PDF) 1 Page - Renesas Technology Corp

Part # R5F52108ADFF
Description  50-MHz 32-bit RX MCUs, 78 DMIPS, up to 512-KB flash memory, 12-bit AD, 10-bit DA
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

R5F52108ADFF Datasheet(HTML) 1 Page - Renesas Technology Corp

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Preliminary Data Sheet
Specifications in this document are tentative and subject to change.
R01DS0041EJ0050 Rev.0.50
Page 1 of 90
Apr 15, 2011
RX210 Group
Renesas MCUs
Features
■ 32-bit RX CPU core
 Max. operating frequency: 50 MHz
Capable of 78 DMIPS in operation at 50 MHz
 Accumulator handles 64-bit results (for a single
instruction) from 32- × 32-bit operations
 Multiplication and division unit handles 32- × 32-bit
operations (multiplication instructions take one CPU
clock cycle)
 Fast interrupt
 CISC Harvard architecture with 5-stage pipeline
 Variable-length instructions, ultra-compact code
 On-chip debugging circuit
■ Low-power design and architecture
 Operation from a single 1.62- to 5.5-V supply
 1.62-V operation available (at up to 20 MHz)
 Deep software standby mode with RTC remaining usable
 Four low-power modes
■ On-chip flash memory for code, no wait states
 50-MHz operation, 20-ns read cycle
 No wait states for reading at full CPU speed
 128- to 512-Kbyte capacities
 User code programmable via the SCI
 Programmable at 1.62 V
 For instructions and operands
■ On-chip data flash memory
 Eight Kbytes, reprogrammable up to TBD times
 Erasing and programming impose no load on the CPU.
■ On-chip SRAM, no wait states
 20- to 64-Kbyte size capacities
■ DMA
 DMACA: Incorporates four channels
 DTC: Four transfer modes
■ ELC
 Module operation can be initiated by event signals
without going through interrupts.
 Modules can operate while the CPU is sleeping.
■ Reset and supply management
 Nine types of reset, including the power-on reset (POR)
 Low voltage detection (LVD) with voltage settings
■ Clock functions
 Frequency of external clock: Up to 20 MHz
 Frequency of the oscillator for sub-clock generation:
32.768 kHz
 PLL circuit input: 4 to 12.5 MHz
 On-chip low- and high-speed oscillators, dedicated on-
chip low-speed oscillator for the IWDT
 Generation of a dedicated 32.768-kHz clock for the RTC
 Clock frequency accuracy measurement circuit (CAC)
■ Real-time clock
 Adjustment functions (30 seconds, leap year, and error)
 Time capture function
 Time capture on event-signal input through external pins
 RTC capable of initiating return from deep software
standby mode
■ Independent watchdog timer
 125-kHz on-chip low-speed oscillator produces a
dedicated clock signal to drive IWDT operation.
■ Useful functions for IEC60730 compliance
 Self-diagnostic and disconnection-detection functions for
the AD converter, clock-frequency accuracy-
measurement circuit, independent watchdog timer,
functions to assist in RAM testing, etc.
■ Up to nine communications interfaces
 SCI with many useful functions (up to seven interfaces)
 Asynchronous mode, clock synchronous mode, smart
card interface
 I2C bus interface: Transfer at up to 1 Mbps, capable of
SMBus operation (1 interface)
 RSPI (1)
■ External address space
 Four CS areas (4 × 16 Mbytes)
 8- or 16-bit bus space is selectable per area
■ Up to 14 extended-function timers
 16-bit MTU2: input capture, output capture,
complementary PWM output, phase counting mode (6
channels)
 8-bit TMR (4 channels)
 16-bit compare-match timers (4 channels)
■ 12-bit A/D converter
 Capable of conversion within 1 μs
 Sample-and-hold circuits (for three channels)
 Three-channel synchronized sampling available
 Self-diagnostic function and analog input disconnection
detection assistance function
■ 10-bit D/A converter
■ Analog comparator
■ Programmable I/O ports
 5-V tolerant, open drain, input pull-up, switching of
driving ability
■ MPC
 Multiple locations are selectable for I/O pins of
peripheral functions
■ Temperature sensor
■ Operating temp. range
 -40 C to +85C
PLQP0100KB-A 14 × 14 mm, 0.5-mm pitch
PLQP0080KB-A 12 × 12 mm, 0.5-mm pitch
PLQP0080JA-A
14 × 14 mm, 0.65-mm pitch
PLQP0064KB-A 10 × 10 mm, 0.5-mm pitch
PLQP0064GA-A 14 × 14 mm, 0.8-mm pitch
PTLG0100JA-A
7 × 7 mm, 0.65-mm pitch
50-MHz 32-bit RX MCUs, 78 DMIPS, up to 512-KB flash memory,
12-bit AD, 10-bit DA, ELC, MPC, RTC, up to 9 comms interfaces;
incorporating functions for IEC60730 compliance
R01DS0041EJ0050
Rev.0.50
Apr 15, 2011


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