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TLWK1109T11 Datasheet(PDF) 5 Page - Toshiba Semiconductor |
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TLWK1109T11 Datasheet(HTML) 5 Page - Toshiba Semiconductor |
5 / 10 page TLWK1109(T11) 2009-10-13 5 Packaging This LED device is packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture absorption. The optical characteristics of the device may be affected by exposure to moisture in the air before soldering and the device should therefore be stored under the following conditions: 1. This moisture proof bag may be stored unopened within 12 months at the following conditions. Temperature: 5 °C to 30°C Humidity: 90% (max) 2. After opening the moisture proof bag, the device should be assembled within 4weeks in an environment of 5°C to 30°C/60% RH or below. 3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to pink) or the expiration date has passed, the device should be baked in taping with reel. After baking, use the baked device within 72 hours, but perform baking only once. Baking conditions: 60 ±5°C, for 24 to 48 hours. Expiration date: 12 months from sealing date, which is imprinted on the label affixed. 4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting. 5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not throw or drop the packed devices. Mounting Method Soldering • Reflow soldering (example) • The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the condition (i.e. the condition more than max(*) values) as a evaluation. Please perform reflow soldering under the above conditions. • Please perform the first reflow soldering with reference to the above temperature profile and within 4weeks of opening the package. • Second reflow soldering In case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. Storage conditions before the second reflow soldering: 30 °C, 60% RH (max) • Make any necessary soldering corrections manually. (only once at each soldering point) Soldering iron: 25 W Temperature : 300 °C or less Time : within 3 s • Do not perform wave soldering. 60~120 s 10 s max 240 °C max 4 °C/s max 140~160 °C 4 °C/s max Time (s) Temperature profile for Pb soldering (example) Time (s) Temperature profile for Pb-free soldering (example) 150~180 °C 4 °C/s max 5 s max 260 °C max 4 °C/s max 230 °C 60~120 s (*) (*) (*) (*) (*) (*) (*) (*) max (*) max (*) max (*) 30~50s max (*) max (*) |
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