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MAX9943ATT Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX9943ATT Datasheet(HTML) 2 Page - Maxim Integrated Products |
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2 / 15 page  High-Voltage, Precision, Low-Power Op Amps 2 _______________________________________________________________________________________ ABSOLUTE MAXIMUM RATINGS Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Supply Voltage (VCC to VEE) ..................................-0.3V to +40V All Other Pins (Note 1) .....................(VEE - 0.3V) to (VCC + 0.3V) OUT Short-Circuit Current Duration 8-Pin μMAX (VCC - VEE ≤ 20V)...............................................3s 8-Pin μMAX (VCC - VEE > 20V) ................................Momentary 6-Pin TDFN (VCC - VEE ≤ 20V) .............................................60s 6-Pin TDFN (VCC - VEE > 20V)...............................................2s 8-Pin SO (VCC - VEE ≤ 20V) .................................................60s 8-Pin SO (VCC - VEE > 20V)...................................................2s 8-Pin TDFN (VCC - VEE ≤ 20V) .............................................60s 8-Pin TDFN (VCC - VEE > 20V)...............................................2s Continuous Input Current (Any Pins) ................................±20mA Thermal Limits (Note 2) Multiple Layer PCB Continuous Power Dissipation (TA = +70°C) 8-Pin μMAX (derate 4.8mW/°C above +70°C) ...........387.8mW 6-Pin TDFN-EP (derate 23.8mW/°C above +70°C) ..1904.8mW 8-Pin SO (derate 7.6mW/°C above +70°C)...................606.1W 8-Pin TDFN-EP (derate 24.4mW/°C above +70°C) ..1951.2mW Operating Temperature Range .........................-40°C to +125°C Junction Temperature ......................................................+150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC CHARACTERISTICS Operating Supply Voltage Range VSUPPLY Guaranteed by PSRR test ±3 ±19 V Quiescent Supply Current per Amplifier ICC 550 950 μA Power-Supply Rejection Ratio PSRR VS = ±3V to ±19V 105 130 dB TA = +25 °C 20 100 Input Offset Voltage VOS TA = -40 °C to +125°C 240 μV Input Offset Voltage Drift TCVOS 0.4 μV/ °C VEE + 0.3V ≤ VCM ≤ VCC - 1.8V 4 20 Input Bias Current IBIAS VEE ≤ VCM ≤ VCC - 1.8V 90 nA Input Offset Current IOS VEE ≤ VCM ≤ VCC - 1.8V 1 10 nA Input Voltage Range VIN+ , VIN- Guaranteed by CMRR test, TA = -40 °C to +125°C VEE VCC - 1.8 V VEE + 0.3V ≤ VCM ≤ VCC - 1.8V 105 125 Common-Mode Rejection Ratio CMRR VEE ≤ VCM ≤ VCC - 1.8V 105 dB ELECTRICAL CHARACTERISTICS (VCC = 15V, VEE = -15V, VCM = 0V, RL = 10kΩ to GND, VGND = 0V, TA = -40°C to +125°C. Typical values are at TA = +25°C, unless otherwise noted.) (Note 3) Note 1: Operation is limited by thermal limits. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. 8 μMAX Junction-to-Ambient Thermal Resistance ( θJA)......206.3°C/W Junction-to-Ambient Case Resistance ( θJC) ...............42°C/W 6 TDFN-EP Junction-to-Ambient Thermal Resistance ( θJA)...........42°C/W Junction-to-Ambient Case Resistance ( θJC) .................9°C/W 8 SO Junction-to-Ambient Thermal Resistance ( θJA).........132°C/W Junction-to-Ambient Case Resistance ( θJC) ...............38°C/W 8 TDFN-EP Junction-to-Ambient Thermal Resistance ( θJA)...........41°C/W Junction-to-Ambient Case Resistance ( θJC) .................8°C/W PACKAGE THERMAL CHARACTERISTICS (Note 2) |
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