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MAX6518UKN035 Datasheet(PDF) 7 Page - Maxim Integrated Products |
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MAX6518UKN035 Datasheet(HTML) 7 Page - Maxim Integrated Products |
7 / 10 page • Calculate the temperature using the formula: • Verify that the temperature measured is within ±2°C of the ambient board temperature. Measure the ambient board temperature using an accurate cali- brated temperature sensor. • Connect OUT to ground (OUT to VCC for cold threshold versions) and observe the state change of the logic output. • Disconnect OUT from ground and observe that the logic output reverts to its initial state. Hysteresis Testing The MAX6516–MAX6519 can be programmed with 2°C or 10°C of hysteresis by pin strapping HYST to VCC or GND, respectively. Below is a test feature that can be used to measure the accuracy of the device’s hystere- sis using a device with a +65°C threshold: • Power up the device and observe the state of the digital output. • Drive the OUT voltage down gradually. • When the digital output changes state, note VOUT. •VOUTtrip = VOUT at logic output change of state (high to low or low to high). • Calculate trip temperature (T1) using: • Gradually raise VOUT until the digital output reverts to its initial state and note VOUT. • Calculate trip temperature (T2). •THYST = T2 - T1. Thermal Considerations The MAX6516–MAX6519 supply current is typically 22µA. When used to drive high-impedance loads, the devices dissipate negligible power. Therefore, the die tempera- ture is essentially the same as the package temperature. Accurate temperature monitoring depends on the thermal resistance between the device being monitored and the MAX6516–MAX6519 die. Heat flows in and out of plastic packages, primarily through the leads. Pin 2 of the 5-pin SOT23 package provides the lowest thermal resistance to the die. Short, wide copper traces between the MAX6516–MAX6519 and the object whose temperature is being monitored ensures heat transfers occur quickly and reliably. The rise in die temperature due to self-heat- ing is given by the following formula: ΔTJ = PDISSIPATION ✕ θJA where PDISSIPATION is the power dissipated by the MAX6516–MAX6519, and θJA is the thermal resistance of the package. The typical thermal resistance is 140°C/W for the 5-pin SOT23 package. To limit the effects of self- heating, minimize the output current. For example, if the MAX6516–MAX6519 sink 1mA, the open-drain output voltage is guaranteed to be less than 0.3V. Therefore, an additional 0.3mW of power is dissipated within the IC. This corresponds to a 0.042°C shift in the die tem- perature in the 5-pin SOT23 package. Chip Information PROCESS: BiCMOS T VOUT =+ − 1 8015 0 01062 30 . . T VOUT =+ − 1 8015 0 01062 30 . . Low-Cost, 2.7V to 5.5V, Analog Temperature Sensor Switches in a SOT23 _______________________________________________________________________________________ 7 |
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