MAX15039ETG datasheet(2/19 Pages) MAXIM

Part #	MAX15039ETG

Description	6A, 2MHz Step-Down Regulator with Integrated Switches Open-Drain, Power-Good Output

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Manufacturer	MAXIM [Maxim Integrated Products]

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2 / 19 page

6A, 2MHz Step-Down Regulator

with Integrated Switches

2

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VIN = VEN = 5V, CVDD = 2.2µF, TA = TJ = -40°C to +85°C, typical values are at TA = +25°C, circuit of Figure 1, unless otherwise

noted.) (Note 3)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

IN, PWRGD to GND..................................................-0.3V to +6V

VDD to GND..................-0.3V to the lower of +4V or (VIN + 0.3V)

COMP, FB, MODE, REFIN, CTL1, CTL2, SS,

FREQ to GND ..........................................-0.3V to (VDD + 0.3V)

OUT, EN to GND ......................................................-0.3V to +6V

BST to LX..................................................................-0.3V to +6V

BST to GND ............................................................-0.3V to +12V

PGND to GND .......................................................-0.3V to +0.3V

LX to PGND ..................-0.3V to the lower of +6V or (VIN + 0.3V)

LX to PGND ..........-1V to the lower of +6V or (VIN + 1V) for 50ns

ILX(RMS) (Note 1) ......................................................................6A

VDD Output Short-Circuit Duration .............................Continuous

Converter Output Short-Circuit Duration ....................Continuous

Continuous Power Dissipation (TA = +70°C)

24-Pin TQFN (derate 27.8mW/°C above +70°C) ........2222mW

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Note 1: LX has internal clamp diodes to PGND and IN. Applications that forward bias these diodes should take care not to exceed

the IC’s package power dissipation limits.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

IN

IN Voltage Range

2.9

5.5

V

VIN = 3.3V

4.9

8

IN Supply Current

fS = 1MHz, no load

VIN = 5V

5.2

8.5

mA

VIN = 5V, VEN = 0V

10

20

Total Shutdown Current from IN

VIN = VDD = 3.3V, VEN = 0V

45

µA

3.3V LDO (VDD)

VDD rising

2.6

2.8

VDD falling

2.35

2.55

V

VDD Undervoltage Lockout

Threshold

LX starts/stops switching

Minimum glitch-width

rejection

10

µs

VDD Output Voltage

VIN = 5V, IVDD = 0 to 10mA

3.1

3.3

3.5

V

VDD Dropout

VIN = 2.9V, IVDD = 10mA

0.08

V

VDD Current Limit

VIN = 5V, VDD = 0V

25

40

mA

BST

BST Supply Current

VBST = VIN = 5V, VLX = 0 or 5V, VEN = 0V

0.025

µA

PWM COMPARATOR

PWM Comparator Propagation

Delay

10mV overdrive

20

ns

PWM Peak-to-Peak Ramp

Amplitude

1V

PWM Valley Amplitude

0.8

V

PACKAGE THERMAL CHARACTERISTICS (Note 2)

TQFN

Junction-to-Ambient Thermal Resistance (

θJA)............36°C/W

Junction-to-Case Resistance (

θJC).................................6°C/W

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