2007-04-26

7

BFR750L3RH

Package TSLP-3-9

Package Outline

Foot Print

Marking Layout (Example)

2

3

1

Pin 1

Top view

Bottom view

2

1

±0.035

0.5

3

1)

0.35

±0.035

2 x 0.15

1)

marking

1) Dimension applies to plated terminal

+0.01

±0.05

Reel ø180 mm = 15.000 Pieces/Reel

Standard Packing

BFR705L3RH

Type code

Pin 1 marking

Laser marking

0.8

4

0.35

Pin 1

marking

For board assembly information please refer to Infineon website "Packages"

Stencil apertures

Copper

Solder mask

0.2

0.5

0.17

0.2

0.225

0.6

0.225

0.15

R0.1

R0.19