MCIMX538DZK1C datasheet(1/204 Pages) FREESCALE

Part #	MCIMX538DZK1C

Description	Applications Processors for Consumer Products

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Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

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Freescale Semiconductor

Data Sheet: Advance Information

Document Number: IMX53CEC

Rev. 2, 5/2011

MCIMX53xD

Package Information

Plastic Package

Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch

Case FC-PBGA PoP 12 x 12 mm

Ordering Information

See Table 1 on page 3

This document contains information on a new product. Specifications and information herein

are subject to change without notice.

1

Introduction

The i.MX53xD multimedia application processor is

Freescale Semiconductor’s latest addition to a growing

family of multimedia-focused products offering high

performance processing optimized for lowest power

consumption.

The i.MX53xD processor features Freescale’s advanced

implementation of the ARM™ core, which operates at

clock speeds as high as 1 GHz and interfaces with

DDR2/LVDDR2-800, LPDDR2-800, or DDR3-800

DRAM memories. This device is suitable for

applications such as the following:

•

Tablets, high-end mobile internet devices (MID)

•

Smart mobile devices

•

Thin clients

•

Internet monitors, media phones, high-end

portable media players (PMP) with HD video

capability

•

Gaming consoles

The flexibility of the i.MX53xD architecture allows for

its use in a wide variety of applications. As the heart of

i.MX53xD Applications

Processors for Consumer

Products

1.

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1.

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3

1.2.

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2.

Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1.

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.

Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.1.

Special Signal Considerations . . . . . . . . . . . . . . . 17

4.

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 17

4.1.

Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 17

4.2.

Power Supplies Requirements and Restrictions . 25

4.3.

I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 28

4.4.

Output Buffer Impedance Characteristics . . . . . . 35

4.5.

I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 39

4.6.

System Modules Timing . . . . . . . . . . . . . . . . . . . . 46

4.7.

External Peripheral Interfaces Parameters . . . . . . 68

4.8.

XTAL Electrical Specifications . . . . . . . . . . . . . . 146

5.

Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 147

5.1.

Boot Mode Configuration Pins . . . . . . . . . . . . . . 147

5.2.

Boot Devices Interfaces Allocation . . . . . . . . . . . 148

5.3.

Power setup during Boot . . . . . . . . . . . . . . . . . . 149

6.

Package Information and Contact Assignments . . . . . 150

6.1.

19x19 mm Package Information . . . . . . . . . . . . . 150

6.2.

19 x 19 mm, 0.8 Pitch Ball Map . . . . . . . . . . . . . 169

6.3.

PoP 12 x 12 mm Package on Package (PoP)

Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173

7.

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201

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