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MPXA6115AC6T1 Datasheet(PDF) 6 Page - Freescale Semiconductor, Inc

Part # MPXA6115AC6T1
Description  High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPXA6115AC6T1 Datasheet(HTML) 6 Page - Freescale Semiconductor, Inc

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MPXA6115A
Sensors
6
Freescale Semiconductor
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
Figure 5. SOP Footprint (Case 482)
Figure 6. SSOP Footprint (Case 1317 and 1317A)
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP
2.54
0.300
7.62
inch
mm
0.100 TYP 8X
2.54
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
0.387
9.83
0.150
3.81
0.050
1.27
TYP


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