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ADP2127 Datasheet(PDF) 5 Page - Analog Devices |
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ADP2127 Datasheet(HTML) 5 Page - Analog Devices |
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5 / 20 page  ADP2126/ADP2127 Rev. A | Page 5 of 20 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating VIN to GND −0.3 V to +6 V EXTCLK to GND −0.3 V to +6 V SW, MODE to GND −0.3 V to VIN FB to GND −0.3 V to +3.6 V Operating Ambient Temperature (TA) –40°C to +85°C1 Operating Junction Temperature (TJ) at ILOAD = 500 mA –40°C to +125°C Soldering Conditions JEDEC J-STD-020 1 The maximum operating junction temperature (TJ (MAX)) supersedes the maximum operating ambient temperature (TA (MAX)). See the Thermal Considerations section for more information. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. THERMAL CONSIDERATIONS The maximum operating junction temperature (TJ (MAX)) supersedes the maximum operating ambient temperature (TA (MAX)) because the ADP2126/ADP2127 may be damaged when the junction temperature limits are exceeded. Monitoring ambient temperature does not guarantee that TJ is within the specified temperature limits. In applications with high power dissipation and poor PCB thermal resistance, the maximum ambient temperature may need to be derated. In applications with moderate power dissipation and good PCB thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within specification limits. The operating junction temperature (TJ) of the device is dependent on the ambient temperature (TA), the power dissipation of the device (PD), and the junction-to-ambient thermal resistance of the package (θJA). TJ is calculated using the following formula: TJ = TA + (PD × θJA) (1) See the Applications Information section for further information on calculating the operating junction temperature for a specific application. THERMAL RESISTANCE θJA of the package is based on modeling and calculation using a 4-layer board. θJA is highly dependent on the application and board layout. In applications where high maximum power dissipation exists, attention to thermal board design is required. The value of θJA may vary, depending on PCB material, layout, and environmental conditions. θJA is specified for worst-case conditions, that is, a device soldered on a circuit board for surface-mount packages. θJA is determined according to JEDEC Standard JESD51-9 on a 4-layer printed circuit board (PCB). Table 3. Thermal Resistance (4-Layer PCB) Package Type θJA Unit 6-Ball Bumped Bare Die Sales 105 °C/W 6-Pad Embedded Wafer Level Package 105 °C/W ESD CAUTION |
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Similar Description - ADP2127 |
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