UDFN8 3.0x2.0, 0.5P

CASE 517BU−01

ISSUE O

DATE 06 APR 2011

DIM

MIN

MAX

MILLIMETERS

A

A1

0.00

0.05

b

0.20

0.30

D

2.00 BSC

E

3.00 BSC

e

0.50 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSIONS b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.25 MM FROM TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

E2

PIN 1

1

D

E

B

A

C

0.15

C

0.15

e

NOTE 3

A

NOTE 4

C

A1

SEATING

PLANE

C

0.05

C

0.05

0.45

0.55

L

0.35

0.45

SCALE 4:1

REFERENCE

TOP VIEW

SIDE VIEW

BOTTOM VIEW

1.06

3.30

0.50

DIMENSIONS: MILLIMETERS

MOUNTING FOOTPRINT

1

B

A

C

C

0.10

0.05

b

8X

D

PITCH

0.63

0.32

OUTLINE

PKG

DETAIL A

(0.065)

(0.127)

DETAIL A

L

RECOMMENDED

8X

8X

4

8

5

8X

D2

A

M

0.10

B

C

M

M

A

M

0.10

B

C

E2

0.85

0.95

D2

1.35

1.45

1.56

XXX

ALL

YM

G

XXX = Specific Device Code

A

= Assembly Location Code

LL = Assembly Lot

Y

= Year

M

= Month

G

= Pb−Free Package

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “ G”,

may or may not be present.

GENERIC

MARKING DIAGRAM*

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

http://onsemi.com

1

© Semiconductor Components Industries, LLC, 2002

October, 2002 − Rev. 0

Case Outline Number:

XXX

DOCUMENT NUMBER:

STATUS:

NEW STANDARD:

DESCRIPTION:

98AON55336E

ON SEMICONDUCTOR STANDARD

UDFN8 3.0 X 2.0, 0.5P

Electronic versions are uncontrolled except when

accessed directly from the Document Repository. Printed

versions are uncontrolled except when stamped

“CONTROLLED COPY” in red.

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