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C1-3N3S-10 Datasheet(PDF) 4 Page - Superworld Electronics |
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C1-3N3S-10 Datasheet(HTML) 4 Page - Superworld Electronics |
4 / 8 page NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 04.06.2009 CERAMIC CHIP INDUCTORS C1 SERIES 6. RELIABILITY & TEST CONDITION : Inductance : Within ±20% of initial value. Step2 : Room temperature 2 to 5 minutes ambient temperature Measurement : After placing for 24 hours (min.) at room Step4 : Room temperature 2 to 5 minutes Step3 : +85±2°C 30±3 min. Number of cycles : 100 45 45 Electrical and mechanical characteristics shall Consult standard J-STD-002 Consult standard MIL-STD-202 Appearance : No significant abnormality Appearance : No mechanical damage. Inductance : Within ±20% of initial value. Appearance : No mechanical damage. Inductance : Within ±20% of initial value. More than 95% coverage of all metabolised area Appearance : No mechanical damage. Temperature Cycle High Temperature Humidity Resistance Resistance Solderability METHOD 210 be satisfied Resistance to Solder Heat Dip Time : 3±1sec. Applied Current : rated current (max. value) Applied Current : rated current (max. value) ambient temperature Measurement : After placing for 24 hours (min.) at room ambient temperature Measurement : After placing for 24 hours (min.) at room Temperature : 60±2°C Duration : 1008±12hrs Condition for 1 cycle Step1 : -40±3°C 30±3 min. Duration : 1008±12hrs Temperature : 85±2°C Humidity : 90~95% RH. Measurement to be made after keeping at room temp Solder : Sn-Ag3.0-Cu0.5 Dip Time : 6±1sec. for 24±2hrs Solder Temperature : 265±3°C Solder Temperature : 240±5°C Solder : Sn-Ag3.0-Cu0.5 Preheat : 100 ~ 150°C, 60sec. 100 unit : mm PERFORMANCE DCR : Shall be satisfied Appearance : No significant abnormality Appearance : No significant abnormality Impedance change : Within ±30% DCR : Shall be satisfied Inductance change : Within ±20% Substrate Bending Strength Terminal Strength DC Resistance ITEM Soldering shall be done in accordance with the by 3mm hold for 10s and then return. recommended PC board pattern and reflow soldering Solder a chip on a test substrate, bend the substrate Solder chip on PCB and applied 10N (1.02Kgf) for 10sec HP4338 digital milli-ohm meter TEST CONDITION |
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