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TMP006 Datasheet(PDF) 6 Page - Texas Instruments |
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TMP006 Datasheet(HTML) 6 Page - Texas Instruments |
6 / 17 page Device ADR0 SCL V+ A3 C3 C1 A1 SDA B3 C2 B1 ADR1 A2 AGND DGND DRDY C >0.01 F m F TMP006 SBOS518 – MAY 2011 www.ti.com OVERVIEW The TMP006 is a digital temperature sensor that is optimal for thermal management and thermal protection applications where remote non-contact sensing is desired. The TMP006 is two-wire and SMBus interface compatible, and is specified over the ambient temperature range of –40°C to +125°C. The TMP006 measures object temperatures over a temperature range of –40°C to +125°C. The TMP006 contains registers for holding configuration information, temperature measurement results, and sensor voltage measurement. The ambient temperature measurement and the sensor voltage measurement are used to calculate the object temperature. Refer to the TMP006 User Guide (SBOU107) for more details. The SCL and SDA interface pins require pull-up resistors (10 k Ω, typical) as part of the communication bus, while DRDY is an open-drain output that must also use a pull-up resistor. DRDY may be shared with other devices if desired for a wired-OR implementation. A 0.01- μF power-supply bypass capacitor is recommended, as shown in Figure 4. Figure 4. Typical Connection Diagram The TMP006 provides both local temperature and the thermopile sensor voltage outputs in a WCSP. The local temperature sensor in the TMP006 is integrated on-chip; the thermal path runs through the WCSP solder balls. The low thermal resistance of the solder balls provides the thermal path to maintain the chip at the temperature of the local environment. The top side of the WCSP must face the object that is being measured with an unobstructed view in order to accurately measure the temperature. Refer to the user guide TMP006 Layout and Assembly Guidelines (SBOU108) for more details. 6 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TMP006 |
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