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TPS22924BYZT Datasheet(PDF) 2 Page - Texas Instruments |
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TPS22924BYZT Datasheet(HTML) 2 Page - Texas Instruments |
2 / 17 page Laser Marking View Bump View C B 2 1 A C B 1 2 A TPS22924B SLVSAR3A – APRIL 2011 – REVISED JUNE 2011 www.ti.com ORDERING INFORMATION(1) TA PACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3) –40°C to 85°C DSBGA – YZ (0.5-mm pitch) Tape and reel TPS22924BYZR ___5N_ (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (3) The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). YZ PACKAGE TERMINALS ASSIGNMENTS (YZ PACKAGE) C GND ON B VOUT VIN A VOUT VIN 1 2 TERMINAL FUNCTIONS NO. NAME DESCRIPTION C1 GND Ground C2 ON Switch control input, active high. Do not leave floating A1, B1 VOUT Switch output A2, B2 VIN Switch input, bypass this input with a ceramic capacitor to ground 2 Copyright © 2011, Texas Instruments Incorporated |
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