LX5512B

Microsemi

Integrated Products Division

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

Page 6

Copyright

© 2004

Rev. 1.0b, 2005-08-18

InGaP HBT 2.4 – 2.5 GHz Power Amplifier

TM

®

PACKAGE DIMENSIONS

LQ

16-Pin MLPQ 3x3

e

D

E

b

E2

D2

A

A3

A1

L

K

Pin 1 Indicator

or

or

Or

e

D

E

b

E2

A

A1

L

K

D2

L1

Dim

MIN

MAX

MIN

MAX

A

0.80

1.00

0.031

0.039

A1

0

0.05

0

0.002

A3

0.20 REF

0.008 REF

b

0.18

0.30

0.007

0.012

D

3.00 BSC

0.118 BSC

E

3.00 BSC

0.118 BSC

e

0.50 BSC

0.020 BSC

D2

1.30

1.55

0.051

0.061

E2

1.30

1.55

0.051

0.061

K

0.2

-

0.008

-

L

0.35

0.50

0.012

0.020

L1

-

0.15

-

0.006

Note:

1.

Dimensions

do

not

include

mold

flash

or

protrusions; these shall not exceed 0.155mm(.006”)

on any side.

Lead dimension shall not include

solder coverage.

2.

Due to multiple qualified assembly sub-contractors

either package (with different pin one indicators)

may be shipped. Package type will be consistent

within the smallest individual container.