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TDM30002D Datasheet(PDF) 1 Page - Microsemi Corporation |
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TDM30002D Datasheet(HTML) 1 Page - Microsemi Corporation |
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1 / 2 page  *Add Suffix A for Common Anode, D for Doubler ROHS Compliant Twin Diode Module TDM300 Microsemi Catalog Number TDM30002* TDM30004* TDM30006* TDM30008* 800V 600V 400V 200V Reverse Voltage Repetitive Peak Compact Package Glass Passivated Die Electrical Characteristics Average forward current per pkg Average forward current per leg Maximum surge current per leg Max peak forward voltage per leg Max peak reverse current per leg F(AV) 600 Amps F(AV) 300 Amps FSM 5500 Amps FM 1.1 Volts RM 75 uA I I I V I C = 130°C, half sine, 0JC = 0.15°C/W 8.3 ms, half sine, J = 175°C FM = 300A: J = 25°C* RRM, J = 25°C* T T V I T T T *Pulse test: Pulse width 8.33 msec, Duty cycle <1% Thermal and Mechanical Characteristics Simplifies Circuit Assembly Storage temp range Operating junction temp range Max thermal resistance per leg Typical thermal resistance per leg (greased) -55°C to 175°C -55°C to 175°C 60-75 inch pounds 0.04°C/W 0.15°C/W T T OJC OCS R R TDM30010* TDM30012* 1000V 1200V Case to sink Weight 9.3 ounces (263.7 grams) typical 2 x 300 Amp Current Rating Working Peak Reverse Voltage 200V 400V 600V 800V 1000V 1200V Non-Isolated Baseplate 2 I t Max I t for fusing 2 2 125990 A s STG J Junction to case C = 130°C, half sine, 0JC = 0.08°C/W Terminal Torque 30-40 inch pounds Mounting Base Torque (outside holes) center hole must be torqued first 8-10 inch pounds Mounting Base Torque (center hole) R R Dim. Inches Millimeters A B C D E F G H J K L M A D E H K H J B M C L F G Min. Max. Min. Max. Notes --- 1.240 --- 3.99 BSC 1.98 BSC 0.320 --- 0.630 0.680 0.610 --- 0.182 4.600 1.260 .925 0.340 --- --- 0.780 0.640 .100 0.192 --- 31.49 --- 101.34 BSC 50.29 BSC 8.13 --- 16.00 17.27 15.49 --- 4.62 116.84 32.00 23.49 8.64 --- --- 19.81 16.26 2.54 4.88 Dia. 5/16-18 Max peak reverse current per leg I RM 10 mA VRRM, J = 150°C T TDM30016* TDM30014* 1400V 1600V 1600V 1400V VRRM 200-1600 Volts Notes: Baseplate: Nickel plated copper. D=Doubler Baseplate A=Common Anode Baseplate Common Cathode Baseplate January, 2010 - Rev. 3 www.microsemi.com |
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