ISL9021A

10

Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time

without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be

accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third

parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

FN7845.0

May 27, 2011

For additional products, see www.intersil.com/product_tree

Wafer Level Chip Scale Package

(WLCSP 0.4mm Ball Pitch)

SIDE VIEW

TOP VIEW

BOTTOM VIEW

PIN 1

E

D

A2

b

A1

e ( E1 )

SE

e ( D1 )

2

b

A

B

SD

A

1

W2x2.4

2x2 ARRAY 4 BALL WAFER LEVEL CHIP SCALE PACKAGE

SYMBOL

MILLIMETERS

A

0.44 Min, 0.495 Nom, 0.55 Max

A1

0.190 ±0.030

A2

0.305 ±0.025

b

0.270 ±0.030

D

1.155 ±0.020

D1

0.400 BASIC

E

0.975 ±0.020

E1

0.400 BASIC

e

0.400 BASIC

SD

0.200 BASIC

SE

0.00 BASIC

NUMBER OF BUMPS: 4

Rev. 2 6/08

NOTES:

1. All dimensions are in millimeters.