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WI565050-1R0KF-99 Datasheet(PDF) 4 Page - Superworld Electronics |
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WI565050-1R0KF-99 Datasheet(HTML) 4 Page - Superworld Electronics |
4 / 6 page SUPERWORLD ELECTRONICS (S) PTE LTD WI565050 SERIES 7. RELIABILTY TEST : NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 4 25.10.2010 MOLDED WIREWOUND CHIP INDUCTORS MIL-STD-202G Method 108A Temp 1/2H Time More than 95% of termincal electrode should Physical Characteristics Tests MIL-STD-202G Method 208H IPC J-STD-002B Reference documents: Solderability Test be covered with solder. Solder : lead free Flux : rosin flux Dip time : 5 secs. Solder temperature : 245±5°C -25°C 1. No case deformation or change in appearance. 1. No case deformation or change in appearance. 1. No case deformation or change in appearance. Reference documents: MIL-STD-202G Method 107G Reference documents: Thermal shock test MIL-STD-202G Method 103B Humidity Test IEC 68-2-1A 6.1 6.2 Low Temperature Storage Test Reference documents: 4. DCR/DCR<10% or 15% Room 0 Temp 85°C Temp Step 1 : -40°C for 30 minute Step 2 : 125°C for 30 minute Conditions of 1 cycle : Total : 20 cycles 96H 93%RH High temperature 0 High humidity Temp & Humidity 40°C Conditions 1H Time Test Room Time : 96±2 hours Temperature : 40±2°C Temp Humidity : 93±3% RH Low temperature -25°C 0 Temp Room 96H Time Test Tested after 1 hour at room temperature 96H Temperature : -25±2°C Time : 96±2 hours Room Temp 0 High temperature 85°C Time 1H Test 1. No case deformation or change in appearance. High Temperature Storage Test Reference documents: Environmental Tests ITEM 2. L/L<10% 3. Q/Q < 30% PERFORMANCE TEST CONDITION Tested after 1 hour at room temperature Temperature : 85±2°C Time : 96±2 hours 3. Q/Q < 30% 4. DCR/DCR<10% or 15% 2. L/L<10% 1H 4. DCR/DCR<10% or 15% 2. L/L<10% 3. Q/Q < 30% Tested after 1 hour at room temperature Room Temp 4. DCR/DCR<10% or 15% 2. L/L<10% 3. Q/Q < 30% 1/2H |
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