SUPERWORLD ELECTRONICS (S) PTE LTD

NOTE : Specifications subject to change without notice. Please check our website for latest information.

PG. 5

25.10.2010

WI565050 SERIES

7. RELIABILTY TEST :

MOLDED WIREWOUND CHIP INDUCTORS

A period of 2 hours in each of 3 mutually perpendicular

Directions & times : X, Y, Z directions for 2 hours.

(1 angle, 1 ridge and 2 surface orientations)

Drop from a height of 1m with 981m/s² (100G) altitude

Bend PCB at middle point, the deflection shall be 2mm.

directions (Total 6 hours).

Amplitude : 0.75mm

Frequency : 10~55Hz

Peak temp. : 245±5°C

Refer to reflow curve.

Terminal Strength Push Test

Pulling Test :

JIS C 5321:1997

Reference documents:

applied on the right conditions.

dielectric must not be damaged by the forces

Bending Test : The terminal electrode & the

8mm²<A<20mm²

A : Sectional area of terminal

20mm²<A

A<8mm²

>10N

10

>20N

10

Bending Test :

R0.5

Time (sec)

Force

>5N

30

X

Pulling Test :

MIL-STD-202G Method 203C

Reference documents:

Drop Test

MIL-STD-202G Method 201A

Reference documents:

Vibration Test

1. No case deformation or change in appearance.

1. No case deformation or change in appearance.

Heat Endurance of

Reflow Soldering

IPC J-STD-020B

Reference documents:

PERFORMANCE

1. No case deformation or change in appearance.

ITEM

No. of cycle : 3

Sample

1.0

Y

10Hz

1Min

Time

55Hz

Freq

TEST CONDITION

4. DCR/DCR<10% or 15%

2. L/L<10%

3. Q/Q < 30%

3. Q/Q < 30%

4. DCR/DCR<10% or 15%

2. L/L<10%

4. DCR/DCR<10% or 15%

3. Q/Q < 30%

2. L/L<10%

270

50

250

200

150

100

300

Preheat

Peak

Ramp-up

Ram p-down

270

260±5°C

Reflow Curve