CY7C199D

Document Number: 38-05471 Rev. *I

Page 5 of 14

Capacitance

Parameter [2]

Description

Test Conditions

Max

Unit

Input capacitance

8

pF

Output capacitance

8pF

Thermal Resistance

Parameter [2]

Description

Test Conditions

28-pin SOJ

28-pin TSOP I Unit

Thermal resistance

(junction to ambient)

Still air, soldered on a 3 × 4.5 inch,

four-layer printed circuit board

59.16

54.65

C/W

Thermal resistance

(junction to case)

40.84

21.49

C/W

AC Test Loads and Waveforms

Figure 3. AC Test Loads and Waveforms [3]

R2

R1 480



3.0 V

GND

90%

10%

90%

10%

5 V

OUTPUT

5pF

INCLUDING

ALL INPUT PULSES

* CAPACITIVE LOAD CONSISTS

OF ALL COMPONENTS OF THE

TEST ENVIRONMENT

30pF*

OUTPUT

Z = 50



50



1.5 V

(a)

(c)

High Z characteristics:

255



JIG AND SCOPE

(b)

Rise Time:

3 ns

Fall Time:

3 ns

Notes

2. Tested initially and after any design or process changes that may affect these parameters.

3. AC characteristics (except high Z) are tested using the load conditions shown in Figure 3 (a). High Z characteristics are tested for all speeds using the test load

shown in Figure 3 (c).

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