CY7C1019D

Document #: 38-05464 Rev. *G

Page 5 of 15

Capacitance [3]

Parameter

Description

Test Conditions

Max

Unit

Input Capacitance

6

pF

Output Capacitance

8

pF

Thermal Resistance [3]

Parameter

Description

Test Conditions

400-Mil

Wide SOJ

TSOP II

Unit

Thermal Resistance

(Junction to Ambient)

Still Air, soldered on a 3 × 4.5 inch, four-layer

printed circuit board

56.29

62.22

C/W

Thermal Resistance

(Junction to Case)

38.14

21.43

C/W

Figure 1. AC Test Loads and Waveforms [4]

90%

10%

3.0 V

GND

90%

10%

ALL INPUT PULSES

* CAPACITIVE LOAD CONSISTS

OF ALL COMPONENTS OF THE

TEST ENVIRONMENT

Rise Time:

3 ns

Fall Time:

3 ns

30 pF*

OUTPUT

Z = 50



50



1.5V

(b)

(a)

5 V

OUTPUT

5 pF

(c)

R1 480



R2

255



High Z characteristics:

INCLUDING

JIG AND

SCOPE

Notes

3. Tested initially and after any design or process changes that may affect these parameters.

4. AC characteristics (except High Z) are tested using the load conditions shown in Figure 1 (a). High Z characteristics are tested for all speeds using the test load

shown in Figure 1 (c).

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