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CY7C1480BV25 Datasheet(PDF) 9 Page - Cypress Semiconductor

Part # CY7C1480BV25
Description  72-Mbit (2 M x 36/4 M x 18/1 M x 72) Pipelined Sync SRAM
Download  34 Pages
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1480BV25 Datasheet(HTML) 9 Page - Cypress Semiconductor

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CY7C1480BV25
CY7C1482BV25, CY7C1486BV25
Document Number: 001-15143 Rev. *H
Page 9 of 34
Functional Overview
All synchronous inputs pass through input registers controlled by
the rising edge of the clock. All data outputs pass through output
registers controlled by the rising edge of the clock. Maximum
access delay from the clock rise (tCO) is 3.0 ns (250 MHz device).
The
CY7C1480BV25/CY7C1482BV25/CY7C1486BV25
supports secondary cache in systems using either a linear or
interleaved burst sequence. The interleaved burst order
supports Pentium and i486
 processors. The linear burst
sequence is suited for processors that use a linear burst
sequence. The burst order is user selectable, and is determined
by sampling the MODE input. Accesses can be initiated with
either the Processor Address Strobe (ADSP) or the Controller
Address Strobe (ADSC). Address advancement through the
burst sequence is controlled by the ADV input. A two-bit on-chip
wraparound burst counter captures the first address in a burst
sequence and automatically increments the address for the rest
of the burst access.
Byte write operations are qualified with the Byte Write Enable
(BWE) and Byte Write Select (BWX) inputs. A Global Write
Enable (GW) overrides all byte write inputs and writes data to all
four bytes. All writes are simplified with on-chip synchronous
self-timed write circuitry.
Three synchronous Chip Selects (CE1, CE2, CE3) and an
asynchronous Output Enable (OE) provide easy bank selection
and output tristate control. ADSP is ignored if CE1 is HIGH.
Single Read Accesses
This access is initiated when the following conditions are
satisfied at clock rise: (1) ADSP or ADSC is asserted LOW,
(2) CE1, CE2, CE3 are all asserted active, and (3) the write
signals (GW, BWE) are all deasserted HIGH. ADSP is ignored if
CE1 is HIGH. The address presented to the address inputs (A)
is stored into the address advancement logic and the Address
Register while being presented to the memory array. The
corresponding data is allowed to propagate to the input of the
Output Registers. At the rising edge of the next clock the data is
allowed to propagate through the output register and onto the
data bus within 3.0 ns (250-MHz device) if OE is active LOW. The
only exception occurs when the SRAM is emerging from a
deselected state to a selected state; its outputs are always
tristated during the first cycle of the access. After the first cycle
of the access, the outputs are controlled by the OE signal.
Consecutive single read cycles are supported. After the SRAM
is deselected at clock rise by the chip select and either ADSP or
ADSC signals, its output tristates immediately.
Single Write Accesses Initiated by ADSP
This access is initiated when both of the following conditions are
satisfied at clock rise: (1) ADSP is asserted LOW, and (2) CE1,
CE2, CE3 are all asserted active. The address presented to A is
loaded into the address register and the address advancement
logic while being delivered to the memory array. The write signals
(GW, BWE, and BWX) and ADV inputs are ignored during this
first cycle.
ADSP-triggered write accesses require two clock cycles to
complete. If GW is asserted LOW on the second clock rise, the
data presented to the DQs inputs is written into the
corresponding address location in the memory array. If GW is
HIGH, then the BWE and BWX signals control the write
operation.
The
CY7C1480BV25/CY7C1482BV25/CY7C1486BV25
provides Byte Write capability that is described in the Truth Table
for Read/Write on page 12. Asserting the Byte Write Enable input
(BWE) with the selected Byte Write (BWX) input, selectively
writes to only the desired bytes. Bytes not selected during a byte
write operation remain unaltered. A synchronous self-timed write
mechanism is provided to simplify the write operations.
Because CY7C1480BV25/CY7C1482BV25/CY7C1486BV25 is
a common I/O device, the Output Enable (OE) must be
deasserted HIGH before presenting data to the DQs inputs.
Doing so tristates the output drivers. As a safety precaution, DQs
are automatically tristated whenever a write cycle is detected,
regardless of the state of OE.
MODE
Input Static
Selects Burst Order. When tied to GND selects linear burst sequence. When tied to VDD or
left floating selects interleaved burst sequence. This is a strap pin and must remain static
during device operation. Mode pin has an internal pull up.
TDO
JTAG Serial
Output
Synchronous
Serial Data Out to the JTAG Circuit. Delivers data on the negative edge of TCK. If the JTAG
feature is not used, this pin must be disconnected. This pin is not available on TQFP packages.
TDI
JTAG Serial Input
Synchronous
Serial Data In to the JTAG Circuit. Sampled on the rising edge of TCK. If the JTAG feature
is not used, this pin can be disconnected or connected to VDD. This pin is not available on
TQFP packages.
TMS
JTAG Serial Input
Synchronous
Serial Data In to the JTAG Circuit. Sampled on the rising edge of TCK. If the JTAG feature
is not used, this pin can be disconnected or connected to VDD. This pin is not available on
TQFP packages.
TCK
JTAG Clock
Clock Input to the JTAG Circuitry. If the JTAG feature is not used, this pin must be connected
to VSS. This pin is not available on TQFP packages.
NC
-
No Connects. Not internally connected to the die. 144M, 288M, 576M, and 1G are address
expansion pins and are not internally connected to the die.
Pin Definitions (continued)
Pin Name
I/O
Description
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