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CY7C1474BV33-200BGXC Datasheet(PDF) 11 Page - Cypress Semiconductor |
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CY7C1474BV33-200BGXC Datasheet(HTML) 11 Page - Cypress Semiconductor |
11 / 33 page CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev. *H Page 11 of 33 load the initial address, as described in Single Write Accesses on page 10. When ADV/LD is driven HIGH on the subsequent clock rise, the Chip Enables (CE1, CE2, and CE3) and WE inputs are ignored and the burst counter is incremented. The correct BW (BWa,b,c,d for CY7C1470BV33, BWa,b for CY7C1472BV33, and BWa,b,c,d,e,f,g,h for CY7C1474BV33) inputs must be driven in each cycle of the burst write to write the correct bytes of data. Sleep Mode The ZZ input pin is an asynchronous input. Asserting ZZ places the SRAM in a power conservation “sleep” mode. Two clock cycles are required to enter into or exit from this “sleep” mode. While in this mode, data integrity is guaranteed. Accesses pending when entering the “sleep” mode are not considered valid nor is the completion of the operation guaranteed. The device must be deselected before entering the “sleep” mode. CE1, CE2, and CE3, must remain inactive for the duration of tZZREC after the ZZ input returns LOW. Interleaved Burst Address Table (MODE = Floating or VDD) First Address Second Address Third Address Fourth Address A1, A0 A1, A0 A1, A0 A1, A0 00 01 10 11 01 00 11 10 10 11 00 01 11 10 01 00 Linear Burst Address Table (MODE = GND) First Address Second Address Third Address Fourth Address A1, A0 A1, A0 A1, A0 A1, A0 00 01 10 11 01 10 11 00 10 11 00 01 11 00 01 10 ZZ Mode Electrical Characteristics Parameter Description Test Conditions Min Max Unit IDDZZ Sleep mode standby current ZZ VDD 0.2 V – 120 mA tZZS Device operation to ZZ ZZ VDD 0.2 V – 2tCYC ns tZZREC ZZ recovery time ZZ 0.2 V 2tCYC –ns tZZI ZZ active to sleep current This parameter is sampled – 2tCYC ns tRZZI ZZ Inactive to exit sleep current This parameter is sampled 0 – ns [+] Feedback |
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