1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

-75 -50 -25

0

25

50

75 100 125 150

Junction Temperature (°C)

2.2

1.6

1.8

2.0

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

-75 -50 -25

0

25

50

75 100 125 150

Junction Temperature (°C)

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Reference Application

device should never be exceeded. Where necessary, an OVP

should be employed to limit the maximum voltage. A cost-

technology, placed in the system circuit will monitor the

current with the MOSFET detection circuit triggering to provide

an effective barrier behind which sensitive electronics are not

exposed to large voltages or currents during surge events. The

block all voltages including the surge up to rated limits.

®

device will automatically reset on lines which have no DC bias

surge. In such cases, special care needs to be taken to ensure

one method used to accomplish this. Bourns application

engineers can provide further assistance.

Basic TBU Operation

Performance Graphs

Typical V-I Characteristics (TBU-CA050-300-WH)

Typical Trip Current vs. Temperature

Equip.

OVP

OVP

Line

Line

TBU

TM

Device

TBU

TM

Device

Line In /

Line Out

Line Out

/ Line In

Line Out

/ Line In

Line In /

Line Out

Typical Resistance vs. Temperature

Power Derating Curve

CURRENT

(100 mA/div)

VOLTAGE

(5 V/div)

No Additional PCB Cu

0.5 sq. in. Additional PCB Cu

Junction Temperature (°C)

20

3.0

2.5

2.0

1.5

1.0

0.5

0.0

40

60

80

100

120

140