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MAX9918 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX9918 Datasheet(HTML) 2 Page - Maxim Integrated Products |
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2 / 18 page  -20V to +75V Input Range, Precision Uni-/Bidirectional, Current-Sense Amplifiers 2 _______________________________________________________________________________________ ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS (VCC = 5V, VRS+ = VRS- = +14V, VSENSE = (VRS+ - VRS-) = 0V, VSHDN = VGND = 0V, VREFIN = VCC/2, RL = 100k Ω; for MAX9918, AV = 90V/V, R2/R1 = 89k Ω/1kΩ; for MAX9920, AV = 20V/V, R2/R1 = 79kΩ/1kΩ; TA = -40°C to +125°C, unless otherwise noted. Typical val- ues are at TA = +25°C.) (Note 1) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. VCC to GND ..............................................................-0.3V to +6V RS+, RS- to GND (VCC = 5V) ..................................-30V to +80V RS+, RS- to GND (VCC = 0V) .............-15V to +80V (15 minutes) Differential Input Voltage (VRS+ - VRS-) (MAX9918/MAX9919).................................±15V (Continuous) Differential Input Voltage (VRS+ - VRS-) (MAX9920) .............................±5V (Continuous) REFIN, FB, OUT to GND.............................-0.3V to (VCC + 0.3V) SHDN to GND.........................................................-0.3V to +20V Output Short Circuit to VCC or GND...........................Continuous Continuous Current into Any Pin (Not to exceed package power dissipation) ................±20mA Continuous Power Dissipation (TA = +70°C) 8-Pin SOIC-EP (derate 24.4mW/°C above +70°C) .1951.2mW** Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C PACKAGE THERMAL CHARACTERISTICS (Note 1) SOIC-EP Junction-to-Ambient Thermal Resistance ( θJA) ...........41°C/W PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS TA = +25°C ±0.14 ±0.4 VRS+ = VRS- = +14V, VREFIN = 0V TA = -40°C to +125°C ±0.7 TA = +25°C ±0.08 ±0.4 MAX9918 VRS+ = VRS- = -2V, VREFIN = 0V TA = -40°C to +125°C ±1.3 TA = +25°C ±0.18 ±0.4 VRS+ = VRS- = +14V, VREFIN = 0V TA = -40°C to +125°C ±0.9 TA = +25°C ±0.11 ±0.4 MAX9919_ VRS+ = VRS- = -2V, VREFIN = 0V TA = -40°C to +125°C ±1.0 TA = +25°C ±0.48 ±1.2 VRS+ = VRS- = +14V, VREFIN = 0V TA = -40°C to +125°C ±3.0 TA = +25°C ±0.10 ±0.9 Input Offset Voltage (Note 2) VOS MAX9920 VRS+ = VRS- = -2V, VREFIN = 0V TA = -40°C to +125°C ±3.5 mV Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. ** As per JEDEC51 Standard (multilayer board). |
Similar Part No. - MAX9918 |
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Similar Description - MAX9918 |
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