6 ______________________________________________________________________________________

Low-Power Headset Detectors

with SEND/END Button Support

Pin Configuration

Pin Description

TDFN

TOP VIEW

*EP/GND

*CONNECT THE EXPOSED PAD (EP/GND) TO THE GROUND PLANE.

MAX14579E

MAX14579AE

1

+

8

MIC

RES

2

7

DETIN

MODE

4

5

CAP

DET

3

6

SWD

PIN

NAME

FUNCTION

1

RES

Resistor Connection. Connect an external 2.2kI resistor from RES to MIC for microphone

biasing.

2

MODE

Microphone Mode Control Input. MODE selects the operating mode. See the MODE Control

Input section for more information.

3

SWD

SEND/END Button Detection Output. SWD asserts when a SEND/END button press event

occurs. SWD is an active-low, open-drain output.

4

DET

Jack Insertion Detection Open-Drain Output. DET is asserted when there is a 3.5mm jack

inserted into the socket. DET is an active-low output.

5

CAP

Internal LDO Output. Connect a 0.22FF ceramic (X5R, X7R, or better) capacitor between CAP

and ground.

6

7

DETIN

Jack Insertion Detection Input. An internal comparator monitors DETIN for jack insertion/

removal events.

8

MIC

Microphone Connection. During audio operation, a 2.2V bias voltage is supplied to MIC

through RES. An internal comparator monitors MIC for SEND/END button press events.

—

EP

Exposed Pad. The exposed pad is the ground connection for the device. Connect EP/GND to

the ground plane.