MAX13330GEEV datasheet(2/15 Pages) MAXIM

Part #	MAX13330GEEV

Description	Automotive DirectDrive Headphone Amplifiers with Output Protection and Diagnostics

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Manufacturer	MAXIM [Maxim Integrated Products]

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Automotive DirectDrive Headphone Amplifiers

with Output Protection and Diagnostics

2

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VDD = VCPVDD = +5V, VSGND = VPGND = 0V, SHDN = VDD, C1 = C2 = 1µF, RL =

∞, resistive load referenced to ground, for

MAX13330 gain = -1.5V/V (internally set), for MAX13331 gain = -1.5V/V (RIN = 30k

Ω, RFB = 45kΩ), TA = TJ = -40°C to +105°C, unless

otherwise noted. Typical values are at TA = +25°C, unless otherwise noted.) (Note 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

VDD, CPVDD to SGND..............................................-0.3V to +6V

VSS, CPVSS to SGND ...............................................+0.3V to -6V

VDD, CPVDD..........................................................-0.3V to +0.3V

VSS, CPVSS ...........................................................-0.3V to +0.3V

SHDN, DIAG to SGND................................-0.3V to (VDD + 0.3V)

OUT_ to PGND.......................................(VCPVSS - 0.3V) to +45V

IN_ to SGND (MAX13330)................(VSS - 0.3V) to (VDD + 0.3V)

IN_ to SGND (MAX13331) ..........................-0.3V to (VDD + 0.3V)

C1P to PGND........................................-0.3V to (VCPVDD + 0.3V)

C1N to PGND..............................................(VSS - 0.3V) to +0.3V

Output Short-Circuit Duration.....................................Continuous

Continuous Power Dissipation (TA = +70°C)

QSOP (derate 9.6mW/°C above +70°C))..................771.5mW

Operating Temperature Range .........................-40°C to +105°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

PACKAGE THERMAL CHARACTERISTICS (Note 1)

QSOP

Junction-to-Ambient Thermal Resistance (

θJA) ......103.7°C/W

Junction-to-Case Thermal Resistance (

θJC) ................37°C/W

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

GENERAL

Amplifier Supply Voltage Range

VDD

4.0

5.5

V

Charge-Pump Supply Voltage

Range

VCPVDD

4.0

5.5

V

Charge-Pump Output Voltage

VCPVSS

-VDD

V

Quiescent Supply Current

IDD

RL =

10

mA

Shutdown Supply Current

ISHDN

10

μA

SHDN Input-Logic High

VIH

2

V

SHDN Input-Logic Low

VIL

0.8

V

SHDN Input Leakage Current

-1

+1

μA

SHDN to Full Operation Time

tSON

100

μs

DIAGNOSTICS

No fault

0.02 x

VDD

OUTR short to

SGND

0.22 x

VDD

0.25 x

VDD

0.28 x

VDD

OUTL short to

SGND

0.47 x

VDD

0.50 x

VDD

0.53 x

VDD

OUTR short to

VBAT

0.72 x

VDD

0.75 x

VDD

0.78 x

VDD

Diagnostic Output Voltage

VDIAG

RDIAG = ,

TA = +25°C

OUTL short to

VBAT

0.97 x

VDD

V

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